Abstract: The invention provides compounds of formula I, wherein the substituents are as set out in further detail in the specification. The compounds are potent inhibitors of GCN2 and they have excellent pharmacokinetic properties. The compounds are useful for the treatment or prevention of a variety of conditions, particularly cancer. The invention further provides pharmaceutical compositions comprising the compounds of the invention and uses of the compounds and the compositions.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Abstract: A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Abstract: A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Abstract: A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier trays that include an adhesive film affixed to a deck area. For example, the adhesive film may be integrally laminated onto the top surface of the carrier tray as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the carrier tray. Semiconductor component(s) can be secured to the carrier tray based on the adhesiveness of the adhesive film. Said another way, proper securement of the semiconductor component(s) to the carrier tray may depend on the tackiness of the constituent material(s) of the adhesive film.

Abstract: A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Abstract: A complementary converter is a switch mode converter circuit that uses one pulse-width modulation (PWM) controller and one power MOSFET to run a two-stage power-factor-corrected (PFC) power supply. The two-stage power-factor-corrected power supply can include a power-factor-corrected boost converter, and a DC-to-DC converter (either step-up or step-down). The DC-to-DC converter can be, e.g., a Flyback, Forward, Cuk, or Buck Converter. The complementary converter circuit includes a voltage input section that takes a universal VAC input and rectifies the input. Then the PFC boost converter boosts the rectified half-cycle DC to a DC line at a higher voltage. The complementary converter circuit further includes an integrated circuit with the power-factor-correction and PWM switching capabilities to control the converters. The DC-to-DC converter brings the voltage down to an appropriate level for the final load (e.g., LEDs).

Abstract: A complementary converter is a switch mode converter circuit that uses one pulse-width modulation (PWM) controller and one power MOSFET to run a two-stage power-factor-corrected (PFC) power supply. The two-stage power-factor-corrected power supply can include a power-factor-corrected boost converter, and a DC-to-DC converter (either step-up or step-down). The DC-to-DC converter can be, e.g., a Flyback, Forward, Cuk, or Buck Converter. The complementary converter circuit includes a voltage input section that takes a universal VAC input and rectifies the input. Then the PFC boost converter boosts the rectified half-cycle DC to a DC line at a higher voltage. The complementary converter circuit further includes an integrated circuit with the power-factor-correction and PWM switching capabilities to control the converters. The DC-to-DC converter brings the voltage down to an appropriate level for the final load (e.g., LEDs).

Abstract: A system, a method and a computer readable medium for storing data elements and related data provenance information. The data elements may be represented in a hyper-table having rows and columns which may be indexed. The data-values of the corresponding data-elements in the hyper-cells may be retrieved based on the indices. Snapshots of the indices may be generated at pre-determined time periods. Checkpoints of the hyper-table may be generated at time periods that are based on transactions on the hyper-table. The hyper-table is capable of being queried as the hyper-table existed at certain time-periods, and data-values of the data-elements may be retrieved as the data-elements existed at such time-periods.

Abstract: Systems and methods for mounting and using various different accessories on a robotic system such as a unmanned ground vehicle (UGV). A tool library may include interchangeable modules, each module having a number of tool holders. Electronic components may be mounted to each of the modules adjacent to each of the of tool holders that identify the module and tool that is associated with the tool holder. The UGV may have a reader that is capable of reading the electronic components to determine the module and tools that are available for use on the UGV.

Abstract: A system, method and computer readable medium for indexing streaming data. Data may be received from distributed devices connected via a network. Data elements may be stored and allocated to data blocks and events of the block stores. Non-text data may be converted into a text representation. The data may be split into terms, and term frequencies of each term within each of the event may be calculated. Block-level term frequency statics may be calculated based on the term frequencies. Tree index structures, such as the Y-tree index, may be generated based on the block-level term frequency data. The Y-tree index structures may use the terms as keys and pointers to the corresponding data blocks and block-level term frequency data. A search query may be performed over the tree index structures.