Abstract: A modular biometric station system is used to form one or more modular biometric stations with cohesive form factors. Such biometric stations include a core unit, one or more end caps, and one or more modules. The modules may be configured to communicably and electrically couple to one or more of the end caps. The end caps may be configured to communicably and electrically couple to the core unit and/or one or more of the modules and may communicably and electrically couple one or more of the modules to the core unit. The core unit, end caps, and/or the modules may be able to communicably interact when coupled together. The core unit, end caps, and modules may all share a form factor. The core unit may include hardware and/or software that satisfies common requirements, and the modules may include peripherals and/or other components that can be coupled to the core unit to adapt the modular biometric station to a variety of different needs of different applications.

Abstract: A modular biometric station system is used to form one or more modular biometric stations with cohesive form factors. Such biometric stations include a core unit, one or more end caps, and one or more modules. The modules may be configured to communicably and electrically couple to one or more of the end caps. The end caps may be configured to communicably and electrically couple to the core unit and/or one or more of the modules and may communicably and electrically couple one or more of the modules to the core unit. The core unit, end caps, and/or the modules may be able to communicably interact when coupled together. The core unit, end caps, and modules may all share a form factor. The core unit may include hardware and/or software that satisfies common requirements, and the modules may include peripherals and/or other components that can be coupled to the core unit to adapt the modular biometric station to a variety of different needs of different applications.

Abstract: A modular biometric station system is used to form one or more modular biometric stations with cohesive form factors. Such biometric stations include a core unit, one or more end caps, and one or more modules. The modules may be configured to communicably and electrically couple to one or more of the end caps. The end caps may be configured to communicably and electrically couple to the core unit and/or one or more of the modules and may communicably and electrically couple one or more of the modules to the core unit. The core unit, end caps, and/or the modules may be able to communicably interact when coupled together. The core unit, end caps, and modules may all share a form factor. The core unit may include hardware and/or software that satisfies common requirements, and the modules may include peripherals and/or other components that can be coupled to the core unit to adapt the modular biometric station to a variety of different needs of different applications.

Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.