Abstract: In order to obtain a self-restoring fuse, it is proposed that a planar thermal bimetal snap element (1, 9) is provided that is secured on the circuit substrate (4) with refractory solder on the basis of at least one solder location and that is thermally coupled to the circuit substrate (4), whereby the solder location is fashioned as first contact location (5) for connection to a corresponding circuit contact of the circuit substrate, and that the snap element (1, 9) is mechanically pre-arched hump-like such that, when the fuse is not activated, it electrically conductively touches a second contact location of the circuit substrate (4) but does not touch it when the fuse has triggered and, thus, the hump curvature has reversed.