Abstract: A dosing device has a dosing tip for dispensing liquid medium and at least one pressure vessel with a pressurizing gas, in which an overpressure or a negative pressure can be set as a predefined pressure setpoint value of an internal pressure by a pressure regulator, wherein the internal pressure is set by the pressurizing gas acting on a first liquid medium. A bidirectional flow meter is provided to measure a quantity of the first medium that is moved by the internal pressure prevailing in the pressure vessel. Furthermore, a dosing valve is provided upstream of the dosing tip, which is adapted to enable or disable a flow of the first medium from the flow meter to the dosing tip. For precise dosing, the first medium is moved by a change in the predefined pressure setpoint value of the internal pressure of at least one pressure vessel, and the moved quantity of the first medium is measured by the flow meter.

Abstract: In a pressure controller for adjusting a pressure in a container connected downstream of the pressure controller and in fluid communication therewith, the pressure controller includes a main fluid duct having a fluid input and a fluid output leading to the container and a control valve for adjusting a fluid pressure at the fluid output, a bypass duct branching off from the main fluid duct downstream of the control valve, configured for venting of the main fluid duct, and a flow cross-section of the bypass duct being smaller than a maximum flow cross-section of the main fluid duct.

Abstract: A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.

Abstract: A method for manufacturing chips (1, 2), in which at least one diaphragm (11, 12) is produced in the surface layer of a semiconductor substrate (10) spanning a cavity (13). The functionality of the chip (1, 2) is then integrated into the diaphragm (11, 12). In order to separate the chip (1, 2), the diaphragm (11, 12) is detached from the substrate composite. The method according to the present invention is characterized by metal plating of the back of the chip (1, 2) in an electroplating process before the chip is separated.

Abstract: A method for manufacturing chips (1, 2), in which at least one diaphragm (11, 12) is produced in the surface layer of a semiconductor substrate (10) spanning a cavity (13). The functionality of the chip (1, 2) is then integrated into the diaphragm (11, 12). In order to separate the chip (1, 2), the diaphragm (11, 12) is detached from the substrate composite. The method according to the present invention is characterized by metal plating of the back of the chip (1, 2) in an electroplating process before the chip is separated.

Abstract: A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.