Patents by Inventor Matthias DROPMANN

Matthias DROPMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible conductor track for connecting electronic modules, particularly modules of a camera to be installed in a vehicle
    Patent number: 11116076
    Abstract: A flexible conductor track (10) for connecting electronic modules, includes conductor track structures (12), two connecting regions (14, 16) for electrically connecting the conductor track structures (12) to corresponding conductor tracks of electronic modules, and at least one long slit (18, 20) in a region (11) in the conductor track (10) located between the two connecting regions. At least one of the connecting regions is designed to be connected to a corresponding connecting region of an electronic module by anisotropic conductive film adhesive (ACFA) bonding.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: September 7, 2021
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Konrad Rothenhaeusler, Franz Pfeiffer, Thilo Berg, Jos Becher, Andreas Schleinkofer, Martin Vallendor, Matthias Dropmann, Oscar Torres Alsina, Steffen Goermer, Patrick Albrecht, Hendrik Powileit, Dieter Kroekel
  • Flexible Conductor Track for Connecting Electronic Modules, Particularly Modules of a Camera to be Installed in a Vehicle
    Publication number: 20190357352
    Abstract: A flexible conductor track (10) for connecting electronic modules, includes conductor track structures (12), two connecting regions (14, 16) for electrically connecting the conductor track structures (12) to corresponding conductor tracks of electronic modules, and at least one long slit (18, 20) in a region (11) in the conductor track (10) located between the two connecting regions. At least one of the connecting regions is designed to be connected to a corresponding connecting region of an electronic module by anisotropic conductive film adhesive (ACFA) bonding.
    Type: Application
    Filed: December 5, 2017
    Publication date: November 21, 2019
    Inventors: Konrad ROTHENHAEUSLER, Franz PFEIFFER, Thilo BERG, Jos BECHER, Andreas SCHLEINKOFER, Martin VALLENDOR, Matthias DROPMANN, Oscar TORRES ALSINA, Steffen GOERMER, Patrick ALBRECHT, Hendrik POWILEIT, Dieter KROEKEL