Abstract: A sensor calibration system includes a gas sensor configured to measure a thermal conductivity of a target gas. The gas sensor includes a reference chamber containing a reference gas, a measurement chamber containing a measurement gas, and a calibration circuit. The reference gas has a first thermal conductivity profile and the measurement gas has a, different, second thermal conductivity profile that are dependent on a first environmental stimulus and a second environmental stimulus. The calibration circuit is configured to, while the first environmental stimulus is varied and the second environmental stimulus is fixed, acquire a plurality of measurements. Each measurement of the plurality of measurements is representative of a difference in thermal conductivity between thermal conductivities of the reference gas and the measurement gas. The calibration circuit is configured to determine a target gas sensitivity of the gas sensor to the target gas based on the plurality of measurements.

Abstract: A gas sensor includes a sensor element for the detection of a gas, an encapsulation, which surrounds the sensor element and has an opening for a gas to be detected to pass through to the sensor element, and a flame arrester, which is arranged in the opening of the encapsulation.

Abstract: A sensor device includes a first sensor die arranged on a base element, a second sensor die arranged on the base element or on a first top surface of the first sensor die. The sensor device further includes an encapsulation material covering a part of the base element and surrounding the first sensor die and the second sensor die such that the first top surface is covered by the encapsulation material and at least a portion of a second top surface of the second sensor die is uncovered by the encapsulation material.

Abstract: A semiconductor device comprises a semiconductor chip and an electrically conductive chip carrier, wherein the semiconductor chip is mounted on the chip carrier. The semiconductor device furthermore comprises an electrically conductive extension element mechanically connected to the chip carrier, wherein the extension element and the chip carrier are formed as an integral single piece. A part of the chip carrier which has the extension element is configured as an antenna.

Abstract: A gas sensor chip for carrying out a thermal conductivity measurement includes: a measuring cavity which has an opening so that an ambient gas can flow into the measuring cavity, a reference cavity which is filled with a reference gas and hermetically sealed, a first and a second measuring cavity bar, which are arranged next to one another and free-standing in the measuring cavity, a first and a second reference cavity bar, which are arranged next to one another and free-standing in the reference cavity, wherein each of the measuring cavity bars and each of the reference cavity bars has a first and a second conductor element, which are electrically insulated from each other and which can, based on an operating mode of the gas sensor chip, in each case be operated as a sensor element and/or as a heating element for a thermal conductivity measurement on the ambient gas.

Abstract: A gas sensor includes a microelectromechanical systems (MEMS) sensing element, a first cavity arranged in the gas sensor, and a first membrane substantially permeable for molecules of an analysis gas and substantially impermeable for molecules larger than molecules of the analysis gas. The first membrane is configured to allow a diffusion of the analysis gas into the first cavity. The MEMS sensing element is sensitive with respect to the analysis gas diffused into the first cavity.

Abstract: A gas sensor comprises a sensor element for the detection of a gas, an encapsulation, which surrounds the sensor element and has an opening for a gas to be detected to pass through to the sensor element, and a flame arrester, which is arranged in the opening of the encapsulation.

Abstract: A method for manufacturing one or more sensors for measuring a gas property includes providing a semiconductor wafer having a front side and a back side; providing a well with a doping type opposite of a doping type of the semiconductor wafer at the front side of the semiconductor wafer; etching at least one reference cavity and at least one measuring cavity in the back side of the semiconductor wafer to form membranes; providing conductive regions within or at a surface of the membranes; forming at least one reference sensor element and at least one measuring sensor element from the conductive regions by etching; and bonding at least one covering wafer to the semiconductor wafer for sealing the reference cavity and covering the measuring cavity.

Abstract: A camera module includes a movable substrate comprising a first main surface and a second main surface arranged opposite to the first main surface; an image sensor mechanically coupled to the first main surface and configured to capture image data; a piezoelectric-actuated micro-electrical-mechanical systems (MEMS) platform mechanically coupled to the second main surface such that the movable substrate and the piezoelectric-actuated MEMS platform are configured to move in unison; at least one piezoelectric actuator coupled to the piezoelectric-actuated MEMS platform; and an actuation circuit configured to receive a motion sensor signal corresponding to a movement, generate at least one actuation signal based on the motion sensor signal, and provide the at least one actuation signal to the at least one piezoelectric actuator to produce a counter mechanical response at the piezoelectric-actuated MEMS platform in response to the movement indicated by the motion sensor signal.

Abstract: The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Abstract: A stacked sensor device includes a micro electromechanical system, MEMS, pressure sensor including a pressure sensor substrate having a recess formed therein, a flexible MEMS structure covering the recess, thereby forming a hermetic chamber within the pressure sensor substrate, and pressure sensing means for detecting a deflection of the flexible MEMS structure. The stacked sensor device further includes a gas sensor including gas sensing means for detecting a property of an ambient gas, the gas sensor being arranged on a standoff above the pressure sensor, such that a cavity is formed by the pressure sensor, the standoff and the gas sensor, and an opening that couples the cavity to the ambient gas.

Abstract: An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

Abstract: It is proposed a sensor for measuring a gas property, wherein the sensor comprises a semiconductor die, wherein the semiconductor die comprises a reference cavity and a measuring cavity, wherein a reference sensor element is arranged in the reference cavity, wherein a measuring sensor element is arranged in the measuring cavity, wherein the reference cavity is sealed from ambient gas, wherein the measuring cavity is fluidly connected to ambient gas. Further it is proposed a method for manufacturing such a sensor.

Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

Abstract: A gas sensor comprises a membrane, a first plate arranged on a first side of the membrane and having through openings for the passage of a gas, a second plate arranged on a second side of the membrane, the second side being situated opposite the first side, and an electronic circuit, which is connected to the membrane, the first plate and the second plate and causes the membrane to emit ultrasonic radiation, and which is configured to determine a resonant frequency of the ultrasonic radiation.

Abstract: A circuit arrangement for operating a resistive sensor element is described. According to an example implementation, the circuit arrangement includes a first supply terminal and a second supply terminal, between which is applied a supply voltage during operation, and a sensor circuit having at least one resistive sensor element. The sensor circuit has a first circuit node and a second circuit node for applying a sensor voltage, wherein the first circuit node is connected to the first supply terminal. The circuit arrangement further includes a sensor supply circuit, which is configured to electrically couple, during a measurement time interval, a charged capacitor to the second circuit node in such a way that the sensor voltage between the first circuit node and the second circuit node is greater than the supply voltage.

Abstract: A sensor calibration system includes a gas sensor configured to measure a thermal conductivity of a target gas. The gas sensor includes a reference chamber containing a reference gas, a measurement chamber containing a measurement gas, and a calibration circuit. The reference gas has a first thermal conductivity profile and the measurement gas has a, different, second thermal conductivity profile that are dependent on a first environmental stimulus and a second environmental stimulus. The calibration circuit is configured to, while the first environmental stimulus is varied and the second environmental stimulus is fixed, acquire a plurality of measurements. Each measurement of the plurality of measurements is representative of a difference in thermal conductivity between thermal conductivities of the reference gas and the measurement gas. The calibration circuit is configured to determine a target gas sensitivity of the gas sensor to the target gas based on the plurality of measurements.

Abstract: A gas sensor includes a hollow space, a gas permeation structure which is arranged between the hollow space and the exterior space and contains a selectively gas-permeable element, wherein the hollow space is hermetically sealed with the exception of the gas permeation structure, and one or more sensor elements which are configured for detecting the presence of one or more gases in the hollow space.

Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.