Abstract: A sensor calibration system includes a gas sensor configured to measure a thermal conductivity of a target gas. The gas sensor includes a reference chamber containing a reference gas, a measurement chamber containing a measurement gas, and a calibration circuit. The reference gas has a first thermal conductivity profile and the measurement gas has a, different, second thermal conductivity profile that are dependent on a first environmental stimulus and a second environmental stimulus. The calibration circuit is configured to, while the first environmental stimulus is varied and the second environmental stimulus is fixed, acquire a plurality of measurements. Each measurement of the plurality of measurements is representative of a difference in thermal conductivity between thermal conductivities of the reference gas and the measurement gas. The calibration circuit is configured to determine a target gas sensitivity of the gas sensor to the target gas based on the plurality of measurements.

Abstract: A gas sensor includes a hollow space, a gas permeation structure which is arranged between the hollow space and the exterior space and contains a selectively gas-permeable element, wherein the hollow space is hermetically sealed with the exception of the gas permeation structure, and one or more sensor elements which are configured for detecting the presence of one or more gases in the hollow space.

Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.

Abstract: A method for operating a thermal conductivity sensor includes the following steps: (i) applying a supply voltage to a measurement element of the thermal conductivity sensor, wherein the supply voltage results in a temperature increase of the measurement element to a characteristic temperature at which the measurement element is sensitive to a thermal conductivity of an analysis gas, (ii) performing a first measurement by the measurement element during the temperature increase before the measurement element has reached the characteristic temperature, thereby providing a first measurement value, (iii) performing a second measurement by the measurement element at a time when the measurement element has reached the characteristic temperature, thereby providing a second measurement value, and (iv) obtaining a compensated measurement value by compensating an offset of the second measurement value based on the first measurement value.

Abstract: A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.

Abstract: A method of communicating with a tire pressure monitoring system (TPMS) sensor module includes transmitting, by the TPMS sensor module, a TPMS signal that includes a sensor identifier of the TPMS sensor module; performing, by an interface device, an angle of arrival measurement on the TPMS signal to whether an angular direction thereof with respect to an antenna array of the interface device is within a predetermined angular window; and determining, by the interface device, whether or not to communicate with the TPMS sensor module including establishing communication with the TPMS sensor module on a condition that the angular direction is within the predetermined angular window and not establishing communication with the TPMS sensor module on a condition that the determined angular direction is not within the predetermined angular window.

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

Abstract: Examples disclose a sensor for measuring a gas property, in particular a gas composition, more particularly a hydrogen level, wherein the sensor includes a semiconductor die, wherein the semiconductor die includes a measuring cavity, wherein a measuring sensor element is arranged in the measuring cavity, wherein the semiconductor die includes a contact pad, wherein the semiconductor die includes a buried conductor, wherein the buried conductor electrically connects the measuring sensor element to the contact pad, wherein a conductive bonding layer of the semiconductor die surrounds the measuring cavity for providing a conductive bonding surface, and wherein the buried conductor is insulated from the conductive bonding layer. Further examples, disclose methods for manufacturing a sensor.

Abstract: An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.

Abstract: A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.

Abstract: A touch sensor includes: a transmitter configured to transmit an ultrasonic transmit wave towards a touch structure; a receiver configured to receive an ultrasonic reflected wave produced from the ultrasonic transmit signal being at least partially reflecting by the touch structure; a receiver circuit configured to convert the ultrasonic reflected wave into a measurement signal; the receiver circuit configured to generate an error value representative of a difference between a measured value of the measurement signal and a reference value; a programmable voltage source configured to provide a bias voltage to the transmitter or to the receiver; a controller configured to adjust the bias voltage based on the error value; a measurement circuit configured to measure the DC bias voltage and determine whether a no-touch event or a touch event has occurred at the touch structure based on at least one measurement of the bias voltage.

Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.

Abstract: The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

Abstract: A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.

Abstract: A gas sensor having a heater, a receiver, and a space arranged between the heater and the receiver, is described, the heater being configured to generate a thermoacoustic sound wave propagating through the space by using a stimulation signal. The receiver is in this case configured to receive the thermoacoustic sound wave that has propagated through the space and to convert it into a reception signal that has a time-of-flight-dependent shift with respect to the stimulation signal and therefore information relating to the gas concentration in the space.

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

Abstract: A gas sensor comprises a membrane, a first plate arranged on a first side of the membrane and having through openings for the passage of a gas, a second plate arranged on a second side of the membrane, the second side being situated opposite the first side, and an electronic circuit, which is connected to the membrane, the first plate and the second plate and causes the membrane to emit ultrasonic radiation, and which is configured to determine a resonant frequency of the ultrasonic radiation.