Patents by Inventor Matthias Friedrich Herrmann

Matthias Friedrich Herrmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11905167
    Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
  • Publication number: 20240017986
    Abstract: A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Inventors: Stefan Barzen, Alexander Frey, Matthias Friedrich Herrmann, Jun Cheng Ooi, Hans-Jörg Timme
  • Publication number: 20230339743
    Abstract: A MEMS device includes a first deflectable membrane structure, a rigid electrode structure and a second deflectable membrane structure in a vertically spaced configuration. The rigid electrode structure is arranged between the first and second deflectable membrane structures. The first and second deflectable membrane structures each includes a deflectable portion, and the deflectable portions of the first and second deflectable membrane structures are mechanically coupled by mechanical connection elements to each other and are mechanically decoupled from the rigid electrode structure. At least a subset of the mechanical connection elements are elongated mechanical connection elements.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 26, 2023
    Inventors: Hans-Jörg Timme, Stefan Barzen, Marc Füldner, Stefan Geißler, Matthias Friedrich Herrmann, Maria Kiriak, Abidin Güçlü Onaran, Konstantin Tkachuk, Arnaud Walther
  • Patent number: 11691871
    Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: July 4, 2023
    Assignee: Infineon Technologies AG
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz
  • Patent number: 11693021
    Abstract: A MEMS vibration sensor includes a piezoelectric membrane including a segmented electrode affixed to a holder; and an inertial mass affixed to the piezoelectric membrane, wherein the segmented electrode includes four segmentation zones, wherein, in an X-direction, a signal from a first segmentation zone is equal to a signal from a third segmentation zone, a signal from a second segmentation zone is equal to a signal from a fourth segmentation zone, and the signal from the first segmentation zone and the signal from the second segmentation zone have opposite signs, and wherein, in a Y-direction, a signal from the first segmentation zone is equal to the signal from the second segmentation zone, the signal from the third segmentation zone is equal to the signal from the fourth segmentation zone, and the signal from first segmentation zone and the signal from the third segmentation zone have opposite signs.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: July 4, 2023
    Assignee: Infineon Technologies AG
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz, Pradyumna Mishra, Daniel Neumaier, David Tumpold
  • Publication number: 20230184610
    Abstract: A sensor arrangement includes a substrate having a through opening between a first and a second main surface region, a sound transducing portion at the first main surface region of the substrate and spanning the through opening in the substrate, and a pressure sensing portion at the first main surface region of the substrate and fluidically coupled to the through opening in the substrate. The sound transducing portion includes a deflectable membrane structure, and a counter electrode. The pressure sensing portion includes a first and second rigid electrode and a deflectable membrane structure. The deflectable membrane structure of the pressure sensing portion opposes the plane of the first main surface region of the substrate. The first and second rigid electrodes of the pressure sensor form a reference capacitor of the pressure sensor, and the second rigid electrode and the membrane structure form a sense capacitor of the pressure sensor.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 15, 2023
    Inventors: Athanasios Kollias, Marc Fueldner, Matthias Friedrich Herrmann, Gunar Lorenz, Andreas Wiesbauer
  • Publication number: 20220402752
    Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
    Type: Application
    Filed: June 18, 2021
    Publication date: December 22, 2022
    Applicants: Infineon Technologies AG, Infineon Technologies AG
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz
  • Patent number: 11524891
    Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: December 13, 2022
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
  • Publication number: 20210385584
    Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 9, 2021
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz, Pradyumna Mishra, Daniel Neumaier, David Tumpold
  • Publication number: 20210139319
    Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.
    Type: Application
    Filed: January 18, 2021
    Publication date: May 13, 2021
    Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
  • Patent number: 10981780
    Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: April 20, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
  • Publication number: 20210053821
    Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 25, 2021
    Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
  • Patent number: 10370242
    Abstract: A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: August 6, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Matthias Friedrich Herrmann, Johannes Manz
  • Patent number: 10175130
    Abstract: An embodiment includes a method of performing a measurement using a micro-electro-mechanical system (MEMS) device that includes a plurality of MEMS sensors having different resonant frequencies. The method includes applying an excitation signal to a first port of the MEMS device such that each of the plurality of the MEMS sensors is stimulated by the excitation signal. The method further includes measuring a signal at a second port of the MEMS device and determining a measured value based on the measuring the signal.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: January 8, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Athanasios Kollias, Matthias Friedrich Herrmann, Christian Ebner, Ernesto Romani, Stephan Mechnig, Joseph Hufschmitt, Andreas Wiesbauer, Christian Jenkner
  • Publication number: 20180029878
    Abstract: A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.
    Type: Application
    Filed: July 28, 2017
    Publication date: February 1, 2018
    Inventors: Alfons Dehe, Matthias Friedrich Herrmann, Johannes Manz
  • Patent number: 9643837
    Abstract: A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: May 9, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Matthias Friedrich Herrmann
  • Publication number: 20160305835
    Abstract: An embodiment includes a method of performing a measurement using a micro-electro-mechanical system (MEMS) device that includes a plurality of MEMS sensors having different resonant frequencies. The method includes applying an excitation signal to a first port of the MEMS device such that each of the plurality of the MEMS sensors is stimulated by the excitation signal. The method further includes measuring a signal at a second port of the MEMS device and determining a measured value based on the measuring the signal.
    Type: Application
    Filed: March 18, 2016
    Publication date: October 20, 2016
    Inventors: Athanasios Kollias, Matthias Friedrich Herrmann, Christian Ebner, Ernesto Romani, Stephan Mechnig, Joseph Hufschmitt, Andreas Wiesbauer, Christian Jenkner