Patents by Inventor Matthias Gloor

Matthias Gloor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11114573
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 7, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirnio, Hartmut Rudmann, Nicola Spring
  • Patent number: 10840396
    Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: November 17, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
  • Patent number: 10761192
    Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: September 1, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Dmitry Bakin, Moshe Doron, Matthias Gloor, Markus Rossi
  • Patent number: 10651624
    Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: May 12, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Matthias Gloor, Yit Chee Chiang
  • Publication number: 20200127147
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Inventors: Martin Lukas BALIMANN, Matthias GLOOR, Philippe BOUCHILLOUX, Jukka ALASIRNIO, Hartmut RUDMANN, Nicola SPRING
  • Patent number: 10566363
    Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 18, 2020
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
  • Patent number: 10566468
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 18, 2020
    Assignee: AMS SENSORS SINGAPORE PTE. LTD
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
  • Patent number: 10509147
    Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: December 17, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD
    Inventors: Markus Rossi, Hans Peter Herzig, Philipp Mueller, Ali Naqavi, Daniel Infante Gomez, Moshe Doron, Matthias Gloor, Alireza Yasan, Hartmut Rudmann, Martin Lukas Balimann, Mai-Lan Elodie Boytard, Bassam Hallal, Daniel Pérez Calero, Julien Boucart, Hendrik Volkerink
  • Patent number: 10466501
    Abstract: The present disclosure describes optoelectronic modules that include an optical system tilted with respect to a focal plane. For example, an optoelectronic module can includes an optical system including a vertical alignment feature. An optoelectronic sub-assembly includes an active optoelectronic device, wherein the vertical alignment rests on a surface of the optoelectronic sub-assembly and wherein an optical axis of the optical system is tilted with respect to a focal plane in the sub-assembly.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: November 5, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Dmitry Bakin, Matthias Gloor
  • Publication number: 20190088801
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Application
    Filed: March 23, 2017
    Publication date: March 21, 2019
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
  • Publication number: 20190081187
    Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.
    Type: Application
    Filed: April 11, 2017
    Publication date: March 14, 2019
    Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
  • Publication number: 20190036297
    Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.
    Type: Application
    Filed: December 23, 2016
    Publication date: January 31, 2019
    Inventors: Matthias Gloor, Yit Chee Chiang
  • Patent number: 10088140
    Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: October 2, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor
  • Publication number: 20180267214
    Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.
    Type: Application
    Filed: January 26, 2016
    Publication date: September 20, 2018
    Inventors: Markus Rossi, Hans Peter Herzig, Philipp Mueller, Ali Naqavi, Daniel Infante Gomez, Moshe Doron, Matthias Gloor, Alireza Yasan, Hartmut Rudmann, Martin Lukas Balimann, Mai-Lan Elodie Boytard, Bassam Hallal, Daniel Pérez Calero, Julien Boucart, Hendrik Volkerink
  • Publication number: 20180252799
    Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.
    Type: Application
    Filed: August 25, 2016
    Publication date: September 6, 2018
    Inventors: Dmitry Bakin, Moshe Doron, Matthias Gloor, Markus Rossi
  • Patent number: 10001583
    Abstract: The present disclosure describes structured light projection in which a structured light projector includes a light emitter and a compound patterned mask. The mask includes a spacer substrate that is transparent to a wavelength of light emitted by the light emitter. On a first side of the spacer substrate is a first reflective surface having apertures therein to allow light to pass through. Lenses are arranged to focus light, produced by the light emitter, toward the apertures in the first reflective surface. A second reflective surface on a second side of the spacer substrate opposite the first side has apertures therein to allow light passing through the spacer substrate to exit the compound patterned mask.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: June 19, 2018
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Dmitry Bakin, Matthias Gloor, Moshe Doron
  • Publication number: 20170350581
    Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 7, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor
  • Publication number: 20170343831
    Abstract: The present disclosure describes optoelectronic modules that include an optical system tilted with respect to a focal plane. For example, an optoelectronic module can includes an optical system including a vertical alignment feature. An optoelectronic sub-assembly includes an active optoelectronic device, wherein the vertical alignment rests on a surface of the optoelectronic sub-assembly and wherein an optical axis of the optical system is tilted with respect to a focal plane in the sub-assembly.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 30, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Dmitry Bakin, Matthias Gloor
  • Publication number: 20170343889
    Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
    Type: Application
    Filed: August 14, 2017
    Publication date: November 30, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
  • Patent number: D799103
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: October 3, 2017
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Matthias Gloor, Martin Lukas Balimann, Peter Riel