Patents by Inventor Matthias Gloor
Matthias Gloor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11114573Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: GrantFiled: December 18, 2019Date of Patent: September 7, 2021Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirnio, Hartmut Rudmann, Nicola Spring
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Patent number: 10840396Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.Type: GrantFiled: April 11, 2017Date of Patent: November 17, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
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Patent number: 10761192Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.Type: GrantFiled: August 25, 2016Date of Patent: September 1, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Dmitry Bakin, Moshe Doron, Matthias Gloor, Markus Rossi
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Patent number: 10651624Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.Type: GrantFiled: December 23, 2016Date of Patent: May 12, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Matthias Gloor, Yit Chee Chiang
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Publication number: 20200127147Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: ApplicationFiled: December 18, 2019Publication date: April 23, 2020Inventors: Martin Lukas BALIMANN, Matthias GLOOR, Philippe BOUCHILLOUX, Jukka ALASIRNIO, Hartmut RUDMANN, Nicola SPRING
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Patent number: 10566468Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: GrantFiled: March 23, 2017Date of Patent: February 18, 2020Assignee: AMS SENSORS SINGAPORE PTE. LTDInventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
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Patent number: 10566363Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: GrantFiled: August 14, 2017Date of Patent: February 18, 2020Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Patent number: 10509147Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.Type: GrantFiled: January 26, 2016Date of Patent: December 17, 2019Assignee: AMS SENSORS SINGAPORE PTE. LTDInventors: Markus Rossi, Hans Peter Herzig, Philipp Mueller, Ali Naqavi, Daniel Infante Gomez, Moshe Doron, Matthias Gloor, Alireza Yasan, Hartmut Rudmann, Martin Lukas Balimann, Mai-Lan Elodie Boytard, Bassam Hallal, Daniel Pérez Calero, Julien Boucart, Hendrik Volkerink
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Patent number: 10466501Abstract: The present disclosure describes optoelectronic modules that include an optical system tilted with respect to a focal plane. For example, an optoelectronic module can includes an optical system including a vertical alignment feature. An optoelectronic sub-assembly includes an active optoelectronic device, wherein the vertical alignment rests on a surface of the optoelectronic sub-assembly and wherein an optical axis of the optical system is tilted with respect to a focal plane in the sub-assembly.Type: GrantFiled: May 25, 2017Date of Patent: November 5, 2019Assignee: AMS SENSORS SINGAPORE PTE. LTD.Inventors: Dmitry Bakin, Matthias Gloor
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Publication number: 20190088801Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: ApplicationFiled: March 23, 2017Publication date: March 21, 2019Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
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Publication number: 20190081187Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.Type: ApplicationFiled: April 11, 2017Publication date: March 14, 2019Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
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Publication number: 20190036297Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.Type: ApplicationFiled: December 23, 2016Publication date: January 31, 2019Inventors: Matthias Gloor, Yit Chee Chiang
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Patent number: 10088140Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.Type: GrantFiled: June 6, 2017Date of Patent: October 2, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Martin Lukas Balimann, Matthias Gloor
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Publication number: 20180267214Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.Type: ApplicationFiled: January 26, 2016Publication date: September 20, 2018Inventors: Markus Rossi, Hans Peter Herzig, Philipp Mueller, Ali Naqavi, Daniel Infante Gomez, Moshe Doron, Matthias Gloor, Alireza Yasan, Hartmut Rudmann, Martin Lukas Balimann, Mai-Lan Elodie Boytard, Bassam Hallal, Daniel Pérez Calero, Julien Boucart, Hendrik Volkerink
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Publication number: 20180252799Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.Type: ApplicationFiled: August 25, 2016Publication date: September 6, 2018Inventors: Dmitry Bakin, Moshe Doron, Matthias Gloor, Markus Rossi
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Patent number: 10001583Abstract: The present disclosure describes structured light projection in which a structured light projector includes a light emitter and a compound patterned mask. The mask includes a spacer substrate that is transparent to a wavelength of light emitted by the light emitter. On a first side of the spacer substrate is a first reflective surface having apertures therein to allow light to pass through. Lenses are arranged to focus light, produced by the light emitter, toward the apertures in the first reflective surface. A second reflective surface on a second side of the spacer substrate opposite the first side has apertures therein to allow light passing through the spacer substrate to exit the compound patterned mask.Type: GrantFiled: March 28, 2016Date of Patent: June 19, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Dmitry Bakin, Matthias Gloor, Moshe Doron
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Publication number: 20170350581Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.Type: ApplicationFiled: June 6, 2017Publication date: December 7, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Martin Lukas Balimann, Matthias Gloor
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Publication number: 20170343831Abstract: The present disclosure describes optoelectronic modules that include an optical system tilted with respect to a focal plane. For example, an optoelectronic module can includes an optical system including a vertical alignment feature. An optoelectronic sub-assembly includes an active optoelectronic device, wherein the vertical alignment rests on a surface of the optoelectronic sub-assembly and wherein an optical axis of the optical system is tilted with respect to a focal plane in the sub-assembly.Type: ApplicationFiled: May 25, 2017Publication date: November 30, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Dmitry Bakin, Matthias Gloor
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Publication number: 20170343889Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: ApplicationFiled: August 14, 2017Publication date: November 30, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Patent number: D799103Type: GrantFiled: May 20, 2016Date of Patent: October 3, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Matthias Gloor, Martin Lukas Balimann, Peter Riel