Abstract: In a method for checking semiconductor wafers and apparatuses for carrying out the method, a lacquer layer applied on a semiconductor wafer is checked. Initially, regions which are to be excluded from the check and surfaces which are to be checked, are ascertained. The checking is effected by direct illumination in such a way that the lacquer layer reflects light. The resulting values of the reflectance are determined and buffer-stored. A determination is performed for each surface as to whether or not it is to be accepted or rejected, in accordance with a predetermined evaluation criterion.