Abstract: A circuit carrier for establishing mechanical and electrical connection for at least one (power) electronics component, having a carrier plate which has at least one passage hole, and at least one electrically and thermally conductive insert element which is arranged in the passage hole and has a first contact surface for establishing electrical and thermal connections to the component and a second contact surface, which faces away from the first contact surface, for establishing thermal connections to a cooling body. The insert element further forms a bushing and has a contact side face which is situated against the bushing and is designed for establishing an electrical and thermal connection to an electrical connecting element.

Abstract: The present disclosure relates to electric motors. The teachings thereof may be embodied in a power module, e.g., a power module for the delivery of a phase current for a current phase of an electric motor. For example, a power module may include: a circuit carrier having a surface; at least two first contact surfaces, a second contact surface, at least two third contact surfaces defined on the surface; a first power transistor connected to each of the at least two first contact surfaces; at least two second power transistors connected to the second contact surface; wherein the at least two second power transistors are connected via a further contact surface to one of the at least two third contact surfaces; and the at least two first and the at least two third contact surfaces are arranged one after the other, in one direction, and the second contact surface is disposed next to both the at least two first and the at least two third contact surfaces.

Abstract: The present disclosure relates to electric motors. The teachings thereof may be embodied in a power module, e.g., a power module for the delivery of a phase current for a current phase of an electric motor. For example, a power module may include: a circuit carrier having a surface; at least two first contact surfaces, a second contact surface, at least two third contact surfaces defined on the surface; a first power transistor connected to each of the at least two first contact surfaces; at least two second power transistors connected to the second contact surface; wherein the at least two second power transistors are connected via a further contact surface to one of the at least two third contact surfaces; and the at least two first and the at least two third contact surfaces are arranged one after the other, in one direction, and the second contact surface is disposed next to both the at least two first and the at least two third contact surfaces.