Abstract: The present disclosure relates to a memory hierarchy for a system-in-package. An example memory hierarchy is connectable to a processor via a memory management unit arranged for translating a virtual address sent by the processor into a physical address. The memory hierarchy has a data cache memory and a memory structure having at least a L1 memory array comprising at least one cluster. The memory structure comprises a first data access controller arranged for managing one or more banks of scratchpad memory of at least one of the clusters of at least the L1 memory array, comprising a data port for receiving at least one physical address and arranged for checking at run-time, for each received physical address, bits of the physical address to see if the physical address is present in the one or more banks of the at least one cluster of at least the L1 memory array.

Abstract: A shoe, in particular a sport shoe, having a sole and a shoe upper part connected to the sole. In order to improve the use properties of the shoe, the sole is made, at least in sections, from an expanded thermoplastic polyolefin.

Abstract: A shoe includes a sole defining a first hollow space and a second hollow space, and a shoe upper that is connected to the sole. The first hollow space within the sole is filled with a first plurality of spherical plastic bodies that are visible through a first transparent region of the sole, and the second hollow space within the sole filled with a second plurality of spherical plastic bodies that are visible through a second transparent region of the sole.