Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

Abstract: In an embodiment an optoelectronic lighting device includes a support and at least one pixel having three illuminating elements, wherein the illuminating elements of the pixel are arranged on an upper side of the support, each illuminating element having a center point, wherein the illuminating elements are arranged around a central point lying on the upper side of the support such that the center points of the illuminating elements lie on a circular path with a defined radius revolving around the central point, wherein each illuminating element includes a base body with a quadrangular base surface, a corner of the base body of each illuminating element lying at least approximately on a line which extends between the center point of the respective illuminating element and the central point, and/or wherein each illuminating element includes a base body with a square base surface, the illuminating elements being arranged on the upper side of the support such that mutually opposite side surfaces of the base body

Abstract: In an embodiment a method for producing a component having a main body, an electrode structure configured for electrically contacting the main body and a housing body bordering the main body and the electrode structure includes providing a container with a liquid solution located therein, wherein the liquid solution includes a light-curing material, and wherein the main body and the electrode structure are disposed in the container and surrounded by the liquid solution, and focusing, by a two-photon lithography, photons on targeted local points on the main body and on the electrode structure thereby polymerizing and curing the solution and forming the housing body.

Abstract: A method for manufacturing a component is disclosed. In an embodiment a method for producing a component includes providing a connection carrier and forming a housing body on at least a part of the connection carrier by a 3D printing method, wherein forming the housing body includes applying at least one layer of a liquid potting compound, selectively curing the at least one layer of the liquid potting compound and removing residues of the liquid potting compound.

Abstract: In an embodiment a component includes at least two component parts configured to generate electromagnetic radiation, two encapsulations and a one-piece carrier frame having a plurality of openings, each opening in form of a through-hole, wherein the component parts are arranged in different openings such that a respective component part is laterally spaced apart from inner walls of an associated opening, wherein each component part is enclosed in lateral directions by one of the encapsulations such that the component parts are mechanically connected to the carrier frame via the encapsulations thereby forming a self-supporting and mechanically stable unit, wherein the carrier frame comprises a casting material, the casting material being a castable silicone, a resin or a plastic material, and wherein the two encapsulations arranged in the two openings of the carrier frame have different materials or different fluorescents.

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.

Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

Abstract: An optoelectronic component includes a first semiconductor emitter and a second semiconductor emitter, each with an active region configured to generate electromagnetic radiation, and each with a front side coupling out area. The optoelectronic component also includes a radiation-impermeable cover layer and a carrier. The semiconductor emitters are on a first side of the carrier. The first semiconductor emitter is configured to emit electromagnetic radiation in a first wavelength range through its coupling out area. The second semiconductor emitter is configured to emit electromagnetic radiation in a second wavelength range through its coupling out area. The first and second wavelength ranges are different from each other. The cover layer is formed with a photopolymer, is arranged on the first side of the carrier, includes a coupling out window which completely penetrates the cover layer, and in which the coupling out areas are at least partially free of the cover layer.

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.

Abstract: In an embodiment an optoelectronic lighting device includes a support and at least one pixel having three illuminating elements, wherein the illuminating elements of the pixel are arranged on an upper side of the support, each illuminating element having a center point, wherein the illuminating elements are arranged around a central point lying on the upper side of the support such that the center points of the illuminating elements lie on a circular path with a defined radius revolving around the central point, wherein each illuminating element includes a base body with a quadrangular base surface, a corner of the base body of each illuminating element lying at least approximately on a line which extends between the center point of the respective illuminating element and the central point, and/or wherein each illuminating element includes a base body with a square base surface, the illuminating elements being arranged on the upper side of the support such that mutually opposite side surfaces of the base body

Abstract: An optoelectronic semiconductor component includes a semiconductor body having a main emission surface and an active region arranged to emit electromagnetic radiation. The optoelectronic semiconductor component also includes a receiving element arranged on the side of the semiconductor body opposite to the main emission surface. The optoelectronic semiconductor component also includes a radiation-transmissive molding compound. The radiation-transmissive molding compound completely surrounds the semiconductor body and the receiving element. A receiver frequency is assigned to the receiving element. The receiving element is configured to extract energy for operating the active region from an alternating electromagnetic field.

Abstract: In an embodiment a component includes at least two component parts configured to generate electromagnetic radiation, two encapsulations and a one-piece carrier frame having a plurality of openings, each opening in form of a through-hole, wherein the component parts are arranged in different openings such that a respective component part is laterally spaced apart from inner walls of an associated opening, wherein each component part is enclosed in lateral directions by one of the encapsulations such that the component parts are mechanically connected to the carrier frame via the encapsulations thereby forming a self-supporting and mechanically stable unit, wherein the carrier frame comprises a casting material, the casting material being a castable silicone, a resin or a plastic material, and wherein the two encapsulations arranged in the two openings of the carrier frame have different materials or different fluorescents.

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.