Patents by Inventor Matthias Keil
Matthias Keil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10404002Abstract: An insulating body for a plug connector is provided, having at least one seat for a contact, the seat being open in the peripheral direction and surrounding a receiving space for the contact over an angular range which is greater than 180 degrees and smaller than 300 degrees, and wherein at least one peripheral edge of the seat has a guide web provided thereon which is elastic in the radial direction of the seat and which has a wall thickness that is greater at the free end than in the region of the connection to the seat.Type: GrantFiled: October 19, 2016Date of Patent: September 3, 2019Assignee: HARTING Electric GmbH & Co. KGInventors: Xiafu Wang, Matthias Keil
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Publication number: 20180337484Abstract: An insulating body for a plug connector is provided, having at least one seat for a contact, the seat being open in the peripheral direction and surrounding a receiving space for the contact over an angular range which is greater than 180 degrees and smaller than 300 degrees, and wherein at least one peripheral edge of the seat has a guide web provided thereon which is elastic in the radial direction of the seat and which has a wall thickness that is greater at the free end than in the region of the connection to the seat.Type: ApplicationFiled: October 19, 2016Publication date: November 22, 2018Inventors: Xiafu Wang, Matthias Keil
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Patent number: 9063408Abstract: The invention to provide curable materials, comprising photo-reactive compounds, in particular, photoinitiators and polymerizable mono- or multifunctional monomers such as acrylates or epoxides. The material may also contain fluoro-surfactants completely or partly terminated by functional groups with the ability to bind covalently to said chemical composition under curing. The curable compositions are either purely acrylate based or a hybrid of different types of monomers such as acrylates, epoxides or vinyl ethers. The polymerizable monomers may cure with the use of different types of photoinitiator, such as free radical photoinitiators or cationic photoinitiators, ultimately forming a hybrid resist comprising interpenetrating networks of different types of monomers e.g. acrylates and epoxides. The acrylate/epoxide hybrid system has showed improved replication properties in terms of high nano-imprint lithography process fidelity, due to increased conversion of acrylates and low shrinkage.Type: GrantFiled: December 10, 2009Date of Patent: June 23, 2015Assignee: Obducat ABInventors: Jakob Nilsson, Matthias Keil, Johan Ring, Babak Heidari
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Patent number: 8970030Abstract: The invention relates to an electronic module and to a method for producing same, comprising a mold body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.Type: GrantFiled: September 23, 2011Date of Patent: March 3, 2015Assignee: Robert Bosch GmbHInventor: Matthias Keil
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Publication number: 20130201614Abstract: The invention relates to an electronic module and to a method for producing same, comprising a mould body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.Type: ApplicationFiled: September 23, 2011Publication date: August 8, 2013Applicant: ROBERT BOSCH GMBHInventor: Matthias Keil
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Patent number: 8426025Abstract: The invention provides a modification of a polymer film surface interaction properties. In this process a polymer carrier object is covered by a chemical composition, comprising photo-polymerizable compounds, photo-initiators or catalysts with the ability to initiate polymerization and semi-fluorinated molecules. The so-produced polymer mold contains semi-fluorinated moieties, which are predominantly located on the surface and on the surface near region of the patterned surface. The polymer mold is suitable as a template with modified properties in a nano-imprint lithography process.Type: GrantFiled: December 10, 2009Date of Patent: April 23, 2013Assignee: Obducat ABInventors: Matthias Keil, Jakob Nilsson, Johan Ring, Babak Heidari
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Publication number: 20120297856Abstract: A method and process for obtaining a metal stamp from an intermediate polymer stamp comprising the steps of providing a first print layer on top of a first polymer layer, imprinting structures to obtain an intermediate stamp. A conductive layer is provided on top of the structures to obtain a seed layer if the imprinted polymer is a non-conductive, plating metal on top of the intermediate polymer stamp to obtain a metal stamp then separating the intermediate stamp from the metal stamp. This invention demonstrates stamp replication in high throughput and at low cost.Type: ApplicationFiled: February 5, 2010Publication date: November 29, 2012Applicant: OBDUCAT ABInventors: Matthias Keil, Gang Luo, Ye Zhou
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Patent number: 8119197Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected front the group consisting of phosphonic acids, phosphinic acids, phosphonates and phosphonate salts, phosphinates and phosphinate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.Type: GrantFiled: March 31, 2010Date of Patent: February 21, 2012Assignee: Obducat ABInventors: Matthias Keil, Göran Frennesson, Marc Beck, Babak Heidari
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Patent number: 7854873Abstract: A method is provided for transferring a pattern from a template (1) to an object (12) in an imprint process, using a two-step process. The first step includes contacting a pattern of the template surface with a polymer material comprising one or more Cyclic Olefin Copolymers (COCs), to produce a flexible polymer replica having a structured surface with an inverse of the pattern of the template surface. In a second step, after releasing the flexible polymer replica from the template, the inverse pattern of the flexible polymer replica is pressed into a resist layer on a substrate, to imprint a replica of the pattern of the template surface in therein.Type: GrantFiled: June 12, 2006Date of Patent: December 21, 2010Assignee: Obducat ABInventors: Babak Heidari, Marc Beck, Matthias Keil
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Publication number: 20100227051Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative: or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected front the group consisting of phosphonic acids, phosphinic acids, phosphonates and phosphonate salts, phosphinates and phosphinate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.Type: ApplicationFiled: March 31, 2010Publication date: September 9, 2010Inventors: Matthias KEIL, Göran FRENNESSON, Marc BECK, Babak HEIDARI
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Publication number: 20100160478Abstract: The invention to provide curable materials, comprising photo-reactive compounds, in particular, photoinitiators and polymerizable mono- or multifunctional monomers such as acrylates or epoxides. The material may also contain fluoro-surfactants completely or partly terminated by functional groups with the ability to bind covalently to said chemical composition under curing. The curable compositions are either purely acrylate based or a hybrid of different types of monomers such as acrylates, epoxides or vinyl ethers. The polymerizable monomers may cure with the use of different types of photoinitiator, such as free radical photoinitiators or cationic photoinitiators, ultimately forming a hybrid resist comprising interpenetrating networks of different types of monomers e.g. acrylates and epoxides. The acrylate/epoxide hybrid system has showed improved replication properties in terms of high nano-imprint lithography process fidelity, due to increased conversion of acrylates and low shrinkage.Type: ApplicationFiled: December 10, 2009Publication date: June 24, 2010Applicant: OBDUCAT ABInventors: Jakob NILSSON, Matthias KEIL, Johan RING, Babak HEIDARI
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Publication number: 20100155988Abstract: The invention provides a modification of a polymer film surface interaction properties. In this process a polymer carrier object is covered by a chemical composition, comprising photo-polymerizable compounds, photo-initiators or catalysts with the ability to initiate polymerization and semi-fluorinated molecules. The so-produced polymer mold contains semi-fluorinated moieties, which are predominantly located on the surface and on the surface near region of the patterned surface. The polymer mold is suitable as a template with modified properties in a nano-imprint lithography process.Type: ApplicationFiled: December 10, 2009Publication date: June 24, 2010Applicant: OBDUCAT ABInventors: Matthias KEIL, Jakob NILSSON, Johan RING, Babak HEIDARI
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Patent number: 7717693Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphonic acids, phosphonates and phosphonate salts, phosphonates and phosphonate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.Type: GrantFiled: May 27, 2005Date of Patent: May 18, 2010Assignee: Obducat ABInventors: Matthias Keil, Göran Frennesson, Marc Beck, Babak Heidari
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Patent number: 7687007Abstract: Method for manufacturing a mold tool (1), devised for forming a structured nanoscale pattern on an object (24) and having a layer (16) which is anti-adhesive with regard to the object (24). A stamp blank (2) is provided with a structured pattern (4) on a surface (8). The patterned surface (8) is coated with a layer (6) of a metal, which has a stable oxidation number and can form a mechanically stable oxide film. The metal layer (6) is oxidized for forming of an oxide film (10). The oxide film (10) is exposed to a reagent comprising molecule chains (18), each of which has a linkage group (20) which bonds to the oxide film (10) by chemical bonding, wherein the molecule chains (18) either at the outset comprise at least a group (22) comprising fluorine, or in a subsequent step is provided with at least one such group (22).Type: GrantFiled: June 16, 2003Date of Patent: March 30, 2010Assignee: Obducat ABInventors: Torbjörn Ling, Lars Montelius, Matthias Keil, Marc Beck
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Publication number: 20070212522Abstract: A method is provided for transferring a pattern from a template (1) to an object (12) in an imprint process, using a two-step process. The first step includes contacting a pattern of the template surface with a polymer material comprising one or more Cyclic Olefin Copolymers (COCs), to produce a flexible polymer replica having a structured surface with an inverse of the pattern of the template surface. In a second step, after releasing the flexible polymer replica from the template, the inverse pattern of the flexible polymer replica is pressed into a resist layer on a substrate, to imprint a replica of the pattern of the template surface in therein.Type: ApplicationFiled: June 12, 2006Publication date: September 13, 2007Inventors: Babak Heidari, Marc Beck, Matthias Keil
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Publication number: 20070166557Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphonic acids, phosphonates and phosphonate salts, phosphonates and phosphonate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.Type: ApplicationFiled: May 27, 2005Publication date: July 19, 2007Inventors: Matthias Keil, Goran Frennesson, Marc Beck, Babak Heidari
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Publication number: 20050287820Abstract: A metal mold for use in a nano-imprinting process comprises a firmly adhering monomolecular non-sticking layer. The later was obtained by subjecting the mold to a reaction with a fluoroalkyl compound having a mercapto group. As a result of said reaction, the layer comprises an organic sulfide of said metal.Type: ApplicationFiled: June 16, 2003Publication date: December 29, 2005Inventors: Torbjorn Ling, Lars Montelius, Matthias Keil, Marc Beck