Patents by Inventor Matthias KUJATH

Matthias KUJATH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit configuration for controlling a power semiconductor device with two circuit carriers and a plastic molded body and arrangement having said configuration
    Patent number: 10863623
    Abstract: A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductivel
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: December 8, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Nicola Burani, Roland Bittner, Matthias Kujath, Peter Mauer
  • CIRCUIT CONFIGURATION FOR CONTROLLING A POWER SEMICONDUCTOR DEVICE WITH TWO CIRCUIT CARRIERS AND A PLASTIC MOLDED BODY AND ARRANGEMENT HAVING SAID CONFIGURATION
    Publication number: 20190335584
    Abstract: A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductivel
    Type: Application
    Filed: March 27, 2019
    Publication date: October 31, 2019
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: NICOLA BURANI, Roland BITTNER, Matthias KUJATH, Peter MAUER