Patents by Inventor Matthias Metz
Matthias Metz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9003885Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: March 14, 2013Date of Patent: April 14, 2015Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 8418559Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: June 28, 2010Date of Patent: April 16, 2013Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 8020266Abstract: Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.Type: GrantFiled: July 14, 2008Date of Patent: September 20, 2011Assignee: Robert Bosch GmbhInventors: Markus Ulm, Brian Stark, Matthias Metz
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Patent number: 7898046Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: July 20, 2009Date of Patent: March 1, 2011Assignee: Robert Bosch GmbHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Publication number: 20100263447Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: ApplicationFiled: June 28, 2010Publication date: October 21, 2010Inventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 7757555Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: August 30, 2006Date of Patent: July 20, 2010Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 7671515Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.Type: GrantFiled: November 7, 2006Date of Patent: March 2, 2010Assignee: Robert Bosch, GmbHInventors: Matthias Metz, Zhiyu Pan, Brian Stark, Markus Ulm, Gary Yama
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Patent number: 7625773Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: GrantFiled: November 4, 2008Date of Patent: December 1, 2009Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Publication number: 20090278214Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: ApplicationFiled: July 20, 2009Publication date: November 12, 2009Applicant: ROBERT BOSCH GMBHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Patent number: 7582514Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: August 24, 2007Date of Patent: September 1, 2009Assignee: Robert Bosch GmbHInventors: Cyril Vancura, Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Patent number: 7563633Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: August 25, 2006Date of Patent: July 21, 2009Assignee: Robert Bosch GmbHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Publication number: 20090065928Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: ApplicationFiled: November 4, 2008Publication date: March 12, 2009Inventors: Markus Lutz, Aaron Partidge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Patent number: 7449355Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: GrantFiled: April 27, 2005Date of Patent: November 11, 2008Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Publication number: 20080265712Abstract: Embodiments of making an energy harvesting device are described. In one embodiment, a case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.Type: ApplicationFiled: July 14, 2008Publication date: October 30, 2008Inventors: Markus Ulm, Brian Stark, Matthias Metz
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Patent number: 7414351Abstract: Embodiments of making an energy harvesting device are described. In one embodiment, a case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.Type: GrantFiled: October 2, 2006Date of Patent: August 19, 2008Assignee: Robert Bosch GmbHInventors: Markus Ulm, Brian Stark, Matthias Metz
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Publication number: 20080122020Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.Type: ApplicationFiled: November 7, 2006Publication date: May 29, 2008Inventors: Matthias Metz, Zhiyu Pan, Brian Stark, Markus Ulm, Gary Yama
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Publication number: 20080079333Abstract: Embodiments of making an energy harvesting device are described. In one embodiment, a case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.Type: ApplicationFiled: October 2, 2006Publication date: April 3, 2008Inventors: Markus Ulm, Brian Stark, Matthias Metz
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Publication number: 20080053228Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: ApplicationFiled: August 30, 2006Publication date: March 6, 2008Inventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Publication number: 20080050861Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: ApplicationFiled: August 24, 2007Publication date: February 28, 2008Inventors: Cyril Vancura, Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Publication number: 20080050845Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: ApplicationFiled: August 25, 2006Publication date: February 28, 2008Inventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller