Abstract: Provided herein is a device for wirelessly communicating with hearing assistance devices. According to various embodiments, the device includes a first interface for communicating with a programmer and a second interface for wirelessly communicating with a hearing assistance device. The second interface is adapted to receive a plurality of communication modules. Each of the modules is adapted for communication with at least one specific type of hearing assistance device. The device includes a housing for the first interface, the second interface, and electrical connections between the interfaces. The housing adapted to be worn around the neck of a person wearing the hearing assistance device.

Abstract: The invention relates to wireless communication between listening devices, in particular to a hearing aid system comprising a hearing instrument and a telephone apparatus. The invention further relates to a method of receiving a telephone call and to the use of a hearing aid system. The object of the present invention is to provide a relatively simple, reliable scheme for receiving a telephone call in a hearing instrument. The problem is solved in that the telephone apparatus comprises a transmitter for establishing a short range digital, low-power link to a hearing instrument comprising a corresponding receiver. This has the advantage of providing a relatively simple and low power solution, where at least the incoming part of a telephone conversation is wirelessly transmitted via a low-power link. The invention may e.g.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract: The invention relates to wireless communication between listening devices, in particular to a hearing aid system comprising a hearing instrument and a telephone apparatus. The invention further relates to a method of receiving a telephone call and to the use of a hearing aid system. The object of the present invention is to provide a relatively simple, reliable scheme for receiving a telephone call in a hearing instrument. The problem is solved in that the telephone apparatus comprises a transmitter for establishing a short range digital, low-power link to a hearing instrument comprising a corresponding receiver. This has the advantage of providing a relatively simple and low power solution, where at least the incoming part of a telephone conversation is wirelessly transmitted via a low-power link. The invention may e.g.

Abstract: The present invention relates to a surface mounted coil (200) for wireless communication. The coil (200) comprises a wire (202) wounded about a core (204) thereby establishing a plurality of windings and having its ends terminated on mounting sections (208) at each end of the core (204). The coil (200) further comprises a shielding layer (212, 300) wound about a central part of the core (204) thereby covering said windings. The shielding layer (212, 300) comprises a shielding pattern and a contact section (214) for connecting to a ground level and to the shielding pattern.

Abstract: The present invention provides a miniature MEMS microphone comprising a single-ended transducer element connected to an amplifier providing a differential electrical output at terminals arranged at a substantially plane exterior surface. The differential or balanced output signal provides a miniature microphone exhibiting a high dynamic range and a reduced susceptibility to EMI. The microphone is adapted for surface mounting thus the extra output terminal required is still suitable for low cost mass production. In preferred embodiments the transducer element and amplifier are silicon-based. The microphone may have a plurality of separate single-ended transducer elements connected to separate amplifiers providing separate differential outputs. The microphones according to the invention are advantageous for applications within for example hearing aids and mobile equipment.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: Provided herein is a device for wirelessly communicating with hearing assistance devices. According to various embodiments, the device includes a first interface for communicating with a programmer and a second interface for wirelessly communicating with a hearing assistance device. The second interface is adapted to receive a plurality of communication modules. Each of the modules is adapted for communication with at least one specific type of hearing assistance device. The device includes a housing for the first interface, the second interface, and electrical connections between the interfaces. The housing adapted to be worn around the neck of a person wearing the hearing assistance device.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process. Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 ?m.

Abstract: The present invention provides a miniature MEMS microphone comprising a single-ended transducer element connected to an amplifier providing a differential electrical output at terminals arranged at a substantially plane exterior surface. The differential or balanced output signal provides a miniature microphone exhibiting a high dynamic range and a reduced susceptibility to EMI. The microphone is adapted for surface mounting thus the extra output terminal required is still suitable for low cost mass production. In preferred embodiments the transducer element and amplifier are silicon-based. The microphone may have a plurality of separate single-ended transducer elements connected to separate amplifiers providing separate differential outputs. The microphones according to the invention are advantageous for applications within for example hearing aids and mobile equipment.

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract: A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process. Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 ?m.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.