Abstract: An optoelectronic apparatus for securing a source of danger in a spatial zone includes at least one image sensor that works in the infrared spectrum and that can generate range-resolved data of the spatial zone as well as an evaluation unit that is configured for the evaluation of the data for the detection of objects in a three-dimensional protected space within the spatial zone, wherein the source of danger is additionally at least partly secured by a mechanical partition that is at least very largely permeable to visually visible light. To provide a solution that prevents or at least reduces disturbing optical influences from outside the partition, it is proposed that the partition is coated with a layer such that the non-coated layer that is at least partly transparent for the image sensor is visible for the image sensor in a defined manner through the layer and is opaque.

Abstract: The present invention relates to a method for the three-dimensional detection of objects in which two images of a scene are detected and mutually corresponding objects in the images are identified by means of a correlation process. A binarization scheme which compares randomly selected point pairs with one another is used in the correlation process. The point pairs are fixed by means of a plurality of iterations.

Abstract: A method for producing an electrical feedthrough in a substrate having an electrical feedthrough, including: forming an etch stop layer on the front side of the substrate; forming a mask on the back side of the substrate; forming an annular trench in the substrate, which trench extends from the back to the front side, by an etching process that stops at the etch stop layer, using the mask, the trench surrounding a substrate punch; depositing a metal layer over the back side of the substrate using the mask, the metal layer penetrating into the annular trench and being deposited on the substrate punch; forming a metal silicide layer on the substrate punch by at least partially converting the metal layer into the metal silicide layer on the substrate punch; selectively removing a remainder of the metal layer; and closing off the annular trench at the back side of the substrate.

Abstract: A method for producing an electrical feedthrough in a substrate having an electrical feedthrough, including: forming an etch stop layer on the front side of the substrate; forming a mask on the back side of the substrate; forming an annular trench in the substrate, which trench extends from the back to the front side, by an etching process that stops at the etch stop layer, using the mask, the trench surrounding a substrate punch; depositing a metal layer over the back side of the substrate using the mask, the metal layer penetrating into the annular trench and being deposited on the substrate punch; forming a metal silicide layer on the substrate punch by at least partially converting the metal layer into the metal silicide layer on the substrate punch; selectively removing a remainder of the metal layer; and closing off the annular trench at the back side of the substrate.

Abstract: A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described.