Abstract: An optical transmitter system for receiving and converting a radio frequency (RF) comprises an RF receiver circuit and at least two signal manipulation paths. The RF receiver circuit is configured to receive an RF signal. The at least two signal manipulation paths are connected with the RF receiver circuit, respectively, to receive the RF signal from the receiver circuit. The signal manipulation paths are configured to process the received RF signal, thereby obtaining a manipulated optical signal, respectively. Each of the signal manipulation paths comprises an electro-optical convertor. The electro-optical convertors are configured to convert RF signals into a corresponding converted optical signal. At least one of the signal manipulation paths comprises a signal manipulation unit configured to adapt a signal processed by the respective signal manipulation path based on at least one operation to obtain a manipulated signal.

Abstract: A method of planarizing a dielectric coating applied over an underlying structure on an integrated circuit wafer employs a two-step chemical mechanical polishing (CMP) process. The underlying structure is characterized as having elevated areas and recessed areas. The wafer can be prepared by applying a first polish stop on the elevated areas, then depositing a layer of dielectric over at least the recessed areas, and finally depositing a second polish stop over the resulting dielectric coating. In some applications a first polish stop is not required. The first step in the two-step CMP is polishing the second polish stop using a slurry that polishes the second polish stop until the second polish stop is substantially removed over the elevated areas. The second step is polishing the dielectric coating that remains using a second slurry that polishes the dielectric at a faster rate than it polishes either the second or first polish stop.