Patents by Inventor Matthias Reinecke

Matthias Reinecke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer catching device
    Patent number: 8201814
    Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: June 19, 2012
    Assignee: DEUTSCHE SOLAR GmbH
    Inventors: Jürgen Döpping, Matthias Reinecke, Holger Brosche, Hans-Joachim Gretzschel, Steffen Pollack
  • Wafer manufacturing method and device
    Patent number: 8123866
    Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: February 28, 2012
    Assignee: Deutsche Solar GmbH
    Inventors: Jürgen Döpping, Matthias Reinecke, Holger Brosche, Hans-Joachim Gretzschel, Steffen Pollack
  • WAFER CATCHING DEVICE
    Publication number: 20080295662
    Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.
    Type: Application
    Filed: November 5, 2007
    Publication date: December 4, 2008
    Inventors: Jurgen Dopping, Matthias Reinecke, Holger Brosche, Hans-Joachim Gretzschel, Steffen Pollack
  • WAFER MANUFACTURING METHOD AND DEVICE
    Publication number: 20080105247
    Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 8, 2008
    Inventors: Jurgen Dopping, Matthias Reinecke, Holger Brosche, Hans-Joachim Gretzschel, Steffen Pollack