Abstract: An integrated circuit (IC) includes circuitry in a plurality of power domains for transmitting and/or receiving radar chirp frames and first and second monitoring systems for monitoring supply voltages of a first and a second subset of the plurality of power domains, respectively. The first subset is monitored outside of a time window during which a chirp frame is transmitted and/or received utilizing circuitry of the IC, and the second subset is monitored during the time window. The first monitoring system includes an output for an error signal indicating a supply voltage in the first subset does not comply with a first voltage parameter. The second monitoring system includes a unique monitoring circuit for each power domain in the second subset, and each unique monitoring circuit includes an output for an error signal indicating a supply voltage in the second subset does not comply with a second voltage parameter.

Abstract: A first error is determined between a bandgap reference output voltage of a bandgap reference circuit at a first temperature and a target voltage. A second temperature of the bandgap reference circuit is measured. A bandgap reference output voltage of the bandgap reference circuit is predicted at the second temperature and based on the first error. A second error is determined between the bandgap reference output voltage and the target voltage. A trim parameter of the bandgap reference circuit is determined based on the second error. The bandgap reference circuit is set with the trim parameter, where a third error between a bandgap reference output voltage of the bandgap reference with the trim parameter is less than the second error.

Abstract: The present disclosure relates to an anticoagulant-coated microporous hollow fiber membrane showing reduced thrombogenicity. The disclosure further relates to a method for producing the membrane and a filtration and/or diffusion device comprising the membrane.

Abstract: A controller for controlling a DC-DC converter in a discontinuous conduction mode (DCM) includes an output module configured to provide a switch control signal to the DC-DC converter having an on-time and a switching frequency. The controller includes an on-time-control-module configured to receive a first compensation signal based on the output voltage of the DC-DC converter; and set the on-time of the switch control signal based on the first compensation signal. The controller also includes a frequency-control-module configured to receive a second compensation signal, wherein the second compensation signal is based on the output voltage of the DC-DC converter, and regulate the second compensation signal to a target range by setting the switching frequency of the switch control signal to one of a plurality of pre-defined discrete switching frequencies.

Abstract: A first error is determined between a bandgap reference output voltage of a bandgap reference circuit at a first temperature and a target voltage. A second temperature of the bandgap reference circuit is measured. A bandgap reference output voltage of the bandgap reference circuit is predicted at the second temperature and based on the first error. A second error is determined between the bandgap reference output voltage and the target voltage. A trim parameter of the bandgap reference circuit is determined based on the second error. The bandgap reference circuit is set with the trim parameter, where a third error between a bandgap reference output voltage of the bandgap reference with the trim parameter is less than the second error.

Abstract: A burst-mode controller for a DC-DC converter includes an output module configured to provide a switch control signal to the DC-DC converter. The switch control signal includes a plurality of burst windows, each burst window corresponding to a period of a fixed-frequency burst clock and having a number of switching cycles. The burst-mode controller includes an on-time-control-module configured to receive a compensation signal based on the output voltage of the DC-DC converter, and set an on-time of the switching cycles of the switch control signal based on the compensation signal. The burst-mode controller also includes a burst-control-module configured to regulate the on-time of the switching cycles of the switch control signal by setting the number of switching cycles for each burst window of the switch control signal.

Abstract: A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the first substrate; at least one rivet having a first end arranged on and electrically coupled to the first side of the first substrate; and an encapsulant encapsulating the at least one power semiconductor die, the at least one rivet and the substrates. At least parts of a second side of the substrates are exposed from the encapsulant. A second end of the at least one rivet is exposed at the encapsulant and configured to accept a press fit pin such that the at least one power semiconductor die can be electrically contacted from the outside.

Abstract: A method for measuring a complex impedance of a plurality of battery cells in a battery pack comprises controlling an excitation current through the plurality of battery cells in the battery pack; receiving, in a single common measurement circuit, a plurality of voltage signals corresponding to the plurality of battery cells; measuring the excitation current; and calculating a complex impedance of each of the battery cells in the plurality of battery cells based on the plurality of voltage signals and the measured excitation current in a single measurement cycle using either one analog-to-digital converter (ADC) per battery cell or two matched ADCs per battery cell.

Abstract: A method produces a micromechanical sensor element having a first electrode and a second electrode, wherein electrode wall surfaces of the first and the second electrodes are situated opposite one another in a first direction and form a capacitance, wherein one of the first electrode or the second electrode is movable in a second direction, in response to a variable to be detected, and a second one of the first electrode and the second electrode is fixed. The method includes producing a cavity in a semiconductor substrate, the cavity being closed by a doped semiconductor layer; producing the first and the second electrodes in the semiconductor layer, including modifying the electrode wall surface of the first electrode in order to have a smaller extent in the second direction than the electrode wall surface of the second electrode.

Abstract: A burst-mode controller for a DC-DC converter includes an output module configured to provide a switch control signal to the DC-DC converter. The switch control signal includes a plurality of burst windows, each burst window corresponding to a period of a fixed-frequency burst clock and having a number of switching cycles. The burst-mode controller includes an on-time-control-module configured to receive a compensation signal based on the output voltage of the DC-DC converter and set an on-time of the switching cycles of the switch control signal based on the compensation signal. The burst-mode controller also includes a burst-control-module configured to regulate the on-time of the switching cycles of the switch control signal by setting the number of switching cycles for each burst window of the switch control signal.

Abstract: A controller for controlling a DC-DC converter in a discontinuous conduction mode (DCM) includes an output module configured to provide a switch control signal to the DC-DC converter having an on-time and a switching frequency. The controller includes an on-time-control-module configured to receive a first compensation signal based on the output voltage of the DC-DC converter; and set the on-time of the switch control signal based on the first compensation signal. The controller also includes and a frequency-control-module configured to receive a second compensation signal, wherein the second compensation signal is based on the output voltage of the DC-DC converter and regulate the second compensation signal to a target range by setting the switching frequency of the switch control signal to one of a plurality of pre-defined discrete switching frequencies.

Abstract: A method for measuring a complex impedance of a plurality of battery cells in a battery pack comprises controlling an excitation current through the plurality of battery cells in the battery pack; receiving, in a single common measurement circuit, a plurality of voltage signals corresponding to the plurality of battery cells; measuring the excitation current; and calculating a complex impedance of each of the battery cells in the plurality of battery cells based on the plurality of voltage signals and the measured excitation current in a single measurement cycle using either one analog-to-digital converter (ADC) per battery cell or two matched ADCs per battery cell.

Abstract: A method produces a micromechanical sensor element having a first electrode and a second electrode, wherein electrode wall surfaces of the first and the second electrodes are situated opposite one another in a first direction and form a capacitance, wherein one of the first electrode or the second electrode is movable in a second direction, in response to a variable to be detected, and a second one of the first electrode and the second electrode is fixed. The method includes producing a cavity in a semiconductor substrate, the cavity being closed by a doped semiconductor layer; producing the first and the second electrodes in the semiconductor layer, including modifying the electrode wall surface of the first electrode in order to have a smaller extent in the second direction than the electrode wall surface of the second electrode.

Abstract: A micromechanical sensor includes a first and a second capacitive sensor element each having a first and a second electrode, wherein electrode wall surfaces of the first electrode and the second electrode are situated opposite one another in a first direction and form a capacitance, wherein the first electrodes are movable in a second direction, which is different than the first direction, in response to a variable to be detected, and the second electrodes are stationary. The electrode wall surface of the first electrode of the first sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the second electrode of the first sensor element. The electrode wall surface of the second electrode of the second sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the first electrode of the second sensor element.

Abstract: Methods and devices related to current sensing are provided. Magnetoresistive sensor elements are provided on opposite sides of a conductor.

Abstract: A method of dynamically establishing a communication connection for mobile equipment (ME) to a process controller of an industrial processing facility (IPF) configured to run an industrial process. The process controller has a computing device includes a processor with a memory storing a different ME classes including a first ME class that the ME is in. The computing device is configured to implement dynamic establishment of a communication connection for ME to the process controller, including reading a representation of a first industrial protocol for the ME while docked at the process controller, translating the representation into a first industrial protocol address, and setting the first industrial protocol address as a first configuration instance in its industrial protocol infrastructure block to render the ME an attached ME. After undocking the ME, the process controller communicates with the ME while controlling the industrial process.

Abstract: A method of dynamically establishing a communication connection for mobile equipment (ME) to a process controller of an industrial processing facility (IPF) configured to run an industrial process. The process controller has a computing device includes a processor with a memory storing a different ME classes including a first ME class that the ME is in. The computing device is configured to implement dynamic establishment of a communication connection for ME to the process controller, including reading a representation of a first industrial protocol for the ME while docked at the process controller, translating the representation into a first industrial protocol address, and setting the first industrial protocol address as a first configuration instance in its industrial protocol infrastructure block to render the ME an attached ME. After undocking the ME, the process controller communicates with the ME while controlling the industrial process.

Abstract: A control circuit provides a signal to a control terminal of the transistor to control the conductivity of the transistor. The control circuit includes a voltage-to-current converter that provides an indication of the control terminal-to-current terminal voltage of a transistor. The control circuit includes control circuitry that uses the indication from the voltage-to-current converter in controlling the current applied to the control terminal.

Abstract: A micromechanical sensor includes a first and a second capacitive sensor element each having a first and a second electrode, wherein electrode wall surfaces of the first electrode and the second electrode are situated opposite one another in a first direction and form a capacitance, wherein the first electrodes are movable in a second direction, which is different than the first direction, in response to a variable to be detected, and the second electrodes are stationary. The electrode wall surface of the first electrode of the first sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the second electrode of the first sensor element. The electrode wall surface of the second electrode of the second sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the first electrode of the second sensor element.

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.