Patents by Inventor Matthias SCHIBLI

Matthias SCHIBLI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor assembly
    Patent number: 10466229
    Abstract: A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: November 5, 2019
    Assignee: SENSIRION AG
    Inventors: Matthias Schibli, Daniel Lehmann
  • SENSOR ASSEMBLY
    Publication number: 20180059091
    Abstract: A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.
    Type: Application
    Filed: July 28, 2017
    Publication date: March 1, 2018
    Applicant: SENSIRION AG
    Inventors: Matthias SCHIBLI, Daniel LEHMANN