Abstract: In a method and apparatus for producing a composite component comprising a hollow profile and at least one injection-molded element, a hollow profile (3) is formed by means of internal high pressure fluid forming and is encapsulated with an injection molding material to form the injection-molded element. The hollow profile is expanded by means of internal high pressure in a closed combination tool comprising an internal high pressure forming tool element and an injection molding tool element, before it is encapsulated. The hollow profile is pressed on the tool engraving only locally in the region of the location to be encapsulated, keeping the outlet of the injection molding channel opening into the tool engraving clear.

Abstract: A method for performing a filleting cut for filleting fish which are conveyed tail-first is carried out along a row of wedge-shaped ray bones projecting away from a main bone stem with a wedge width increasing from ray bone to ray bone by means of a pair of circular knives having sharp cutting edges. Starting from the tail end, meat of each fish is cut by means of the circular knife pair having a V-shaped arrangement as a result of the fact that a cutting gap having the smallest cutting edge spacing is set to a basic size which is at least substantially equal to or smaller than a wedge width of the outermost ray bone at the tail end of the conveyed fish.

Abstract: The invention relates to an apparatus for filleting decapitated and gutted fish, comprising a cutting unit for filleting the fish, wherein the cutting unit has at least one pair of circular blades, and an endlessly rotating transport conveyor with at least one saddle-shaped supporting body for receiving the fish and conveying them in the direction of transport T through the cutting unit tail first, which is distinguished in that the two circular blades of a pair of circular blades are driven in opposite directions. Furthermore the invention relates to a corresponding method.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: A semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat conducting body each. The heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element. A spacer, which with regard to the third connection, is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the joining zone thickness of the third connection being greater than that of the first or the second joining zone to ensure that defined joining zone thicknesses in the bonded connection is maintained during the joining process. The third connection can be used for at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates to an apparatus for filleting decapitated and gutted fish, comprising a cutting unit for filleting the fish, wherein the cutting unit has at least one pair of circular blades, and an endlessly rotating transport conveyor with at least one saddle-shaped supporting body for receiving the fish and conveying them in the direction of transport T through the cutting unit tail first, which is distinguished in that the two circular blades of a pair of circular blades are driven in opposite directions. Furthermore the invention relates to a corresponding method.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: In a method and apparatus for producing a composite component, a tubular hollow section blank is placed into a die cavity of a combination tool comprising an inner high-pressure shaping tool and an injection-molding tool. The combination tool is filled with a fluid in such a way that the blank is wetted from the inside by the fluid, and the ends of the combination tool are sealed by two axial molding plugs. The filled blank is then expanded under pressure . The finished hollow section is plastic-coated in the same tool. The hollow section is emptied after shaping in the sealed state, at least until it is no longer dripping, the pressurized fluid being expelled under pressure from the hollow section through at least one discharge channel formed in the axial molding plugs.

Abstract: The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: In a method and apparatus for producing a composite component comprising a hollow profile and at least one injection-molded element, a hollow profile (3) is formed by means of internal high pressure fluid forming and is encapsulated with an injection molding material to form the injection-molded element. The hollow profile is expanded by means of internal high pressure in a closed combination tool comprising an internal high pressure forming tool element and an injection molding tool element, before it is encapsulated. The hollow profile is pressed on the tool engraving only locally in the region of the location to be encapsulated, keeping the outlet of the injection molding channel opening into the tool engraving clear.

Abstract: The invention relates to a method and device (1) for producing a composite component, wherein a tubular, hollow section blank (5) is placed into the die cavity (3) of a combination tool comprising an inner high-pressure shaping tool (2) and an injection-molding tool, the combination tool is filled with a fluid in such a way that the blank (5) is wetted from the inside by the fluid, and the ends of the combination tool are sealed by two axial molding plugs (6 and 7). The filled blank (5) under pressure is then widened. The finished hollow section (22) is then plastic-coated in the same tool. In order to produce the composite component in a relatively simple manner and by a reliable process, it is suggested to empty the hollow section (22) after shaping in the sealed state at least until it is no longer dripping, wherein the pressurized fluid (19) is expelled under pressure from the hollow section (22) through at least one discharge channel formed in the axial molding plugs (6 and 7).

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: The invention relates to a device (10) for the internal high pressure forming of a hollow profile (5), comprising a forming tool and a sealing arrangement for holding and sealing an end (12) of the hollow profile (5), this end (12) projecting from the impression (16) of the forming tool, the sealing arrangement (11) having a section (6), plunging into the hollow profile (5), of an axial punch (4) and at least one clamping jaw (3) which, when the section (6) of the axial punch (4) has plunged in, presses radially from outside on the hollow profile end (12) in such a way that the clamping jaw (3) fixes the latter in position. It is essential to the invention in this case that an actuator (14) is provided which drives the clamping jaw (3) for displacing it only radially to the hollow profile axis.

Abstract: The invention relates to a method for producing a peripherally closed hollow profiled element by means of internal high-pressure forming, a hollow elongated blank (5) being inserted into an internal high-pressure forming tool (1), and the blank (5) located completely inside the forming tool (1) after the insertion being compressed in a region lying between its ends (9, 10) during the closing operation of the forming tool (1), after which the compressed blank (5) is expanded into the final shape of the hollow profiled element by means of fluidic internal high pressure.

Abstract: Device for processing flesh, including at least one transport means, at least one element for position detection as well as at least one separating means and at least one regulating and/or control device, wherein the separating means communicates by means of the regulating and/or control device with the element for position detection.

Abstract: A device for processing flesh includes at least one transport belt, at least one element for position detection as well as at least one separating device and at least one control device, wherein the separating device communicates via the control device with the element for position detection which provides information to be recorded and processed into geometric data of the flesh and image data of the flesh so that separating cuts based on the geometric and image data can be made with the separating device.