Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates to an apparatus for filleting decapitated and gutted fish, comprising a cutting unit for filleting the fish, wherein the cutting unit has at least one pair of circular blades, and an endlessly rotating transport conveyor with at least one saddle-shaped supporting body for receiving the fish and conveying them in the direction of transport T through the cutting unit tail first, which is distinguished in that the two circular blades of a pair of circular blades are driven in opposite directions. Furthermore the invention relates to a corresponding method.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: In a method and apparatus for producing a composite component, a tubular hollow section blank is placed into a die cavity of a combination tool comprising an inner high-pressure shaping tool and an injection-molding tool. The combination tool is filled with a fluid in such a way that the blank is wetted from the inside by the fluid, and the ends of the combination tool are sealed by two axial molding plugs. The filled blank is then expanded under pressure . The finished hollow section is plastic-coated in the same tool. The hollow section is emptied after shaping in the sealed state, at least until it is no longer dripping, the pressurized fluid being expelled under pressure from the hollow section through at least one discharge channel formed in the axial molding plugs.

Abstract: The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: In a method and apparatus for producing a composite component comprising a hollow profile and at least one injection-molded element, a hollow profile (3) is formed by means of internal high pressure fluid forming and is encapsulated with an injection molding material to form the injection-molded element. The hollow profile is expanded by means of internal high pressure in a closed combination tool comprising an internal high pressure forming tool element and an injection molding tool element, before it is encapsulated. The hollow profile is pressed on the tool engraving only locally in the region of the location to be encapsulated, keeping the outlet of the injection molding channel opening into the tool engraving clear.

Abstract: The invention relates to a method and device (1) for producing a composite component, wherein a tubular, hollow section blank (5) is placed into the die cavity (3) of a combination tool comprising an inner high-pressure shaping tool (2) and an injection-molding tool, the combination tool is filled with a fluid in such a way that the blank (5) is wetted from the inside by the fluid, and the ends of the combination tool are sealed by two axial molding plugs (6 and 7). The filled blank (5) under pressure is then widened. The finished hollow section (22) is then plastic-coated in the same tool. In order to produce the composite component in a relatively simple manner and by a reliable process, it is suggested to empty the hollow section (22) after shaping in the sealed state at least until it is no longer dripping, wherein the pressurized fluid (19) is expelled under pressure from the hollow section (22) through at least one discharge channel formed in the axial molding plugs (6 and 7).

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: The invention relates to a device (10) for the internal high pressure forming of a hollow profile (5), comprising a forming tool and a sealing arrangement for holding and sealing an end (12) of the hollow profile (5), this end (12) projecting from the impression (16) of the forming tool, the sealing arrangement (11) having a section (6), plunging into the hollow profile (5), of an axial punch (4) and at least one clamping jaw (3) which, when the section (6) of the axial punch (4) has plunged in, presses radially from outside on the hollow profile end (12) in such a way that the clamping jaw (3) fixes the latter in position. It is essential to the invention in this case that an actuator (14) is provided which drives the clamping jaw (3) for displacing it only radially to the hollow profile axis.

Abstract: The invention relates to a method for producing a peripherally closed hollow profiled element by means of internal high-pressure forming, a hollow elongated blank (5) being inserted into an internal high-pressure forming tool (1), and the blank (5) located completely inside the forming tool (1) after the insertion being compressed in a region lying between its ends (9, 10) during the closing operation of the forming tool (1), after which the compressed blank (5) is expanded into the final shape of the hollow profiled element by means of fluidic internal high pressure.

Abstract: A roof frame arrangement of a motor vehicle has a front, a rear and two lateral roof frames, and a supporting device for a motor vehicle tailgate. The supporting device includes a tailgate hinge and at least one gas-filled compression spring. At least the lateral roof frame contains an inner shell and an outer shell connected to the latter. A hollow space is formed between the inner shell and outer shell. In order to provide a roof frame arrangement having increased stiffness, which can be produced in a simple and space-saving manner and with as few manufacturing tolerances as possible and in which a relatively great outlay on leakproofness is not required, it is proposed to form a rear end region of the lateral roof frame as a single-piece, circumferentially closed hollow profile which encloses the hollow space there and forms a receiving housing in which at least one of the hinge and the gas-filled compression spring is fitted.

Abstract: A rear roof frame of a motor vehicle has a tailgate which is fastened to the roof frame and includes an upper shell and a lower shell which is fitted to the latter. For the design of a rear roof frame, which, in spite of the shell-type construction, provides, in a simple manner and lightweight construction, sufficient torsional and flexural stiffness in order to withstand high mechanical stresses, it is proposed to arrange within the shell structure a hollow profile which leads in each case from the transition region to the lateral roof frame and parallel to the longitudinal extent of the structure, and emerges, at least at the end facing away from the lateral roof frame, in a knee which kinks in the front-end direction of the vehicle. The end of the rear roof frame forms a tubular hollow profile of the lateral roof frame, which is connected to the hollow profile of the rear roof frame.

Abstract: The invention relates to a rear roof frame of a motor vehicle, having a tailgate which is fastened to the roof frame, the rear roof frame comprising an upper shell and a lower shell which is fitted to the latter.

Abstract: A method is disclosed for joining an electrical contact of minor thermal function to a high-power diode laser bar, comprises the step of joining the contact and the HDB by a joining material containing an adhesive. A high-power diode laser bar-contact arrangement comprises a high-power diode laser bar, an electrical contact of minor thermal function and a joint zone between the HDB and the contact. The joint zone contains a joining material with an adhesive. The disclosure also describes a high-power diode laser comprising an HDB, two electrical contacts of minor thermal function and two joint zones between the contacts and the HDB. The joint zones contain joining materials with adhesives. A high-power diode laser stack is also described.

Abstract: A method and an apparatus are provided for internal high-pressure forming of a workpiece in a closed internal high-pressure forming die. The workpiece is expanded owing to the internal high fluid pressure exerted by a pressure generator and coming to rest on the cavity of the forming die. The workpiece and the forming die form friction partners in the areas of contact. In order to improve process reliability during the internal high-pressure forming of workpieces and to expand the scope of the method, vibration is imparted directly to at least one of the friction partners by a vibration generator during forming.

Abstract: A device for manufacturing a hollow body from two plates. The device includes an internal high pressure forming tool having an interior surface defining a mold chamber corresponding to a shape of the hollow body. The forming tool being arranged to receive two plates resting against each other. An expansion lance is insertable between the plates via an axial drive, and the expansion lance and the axial drive forming a pushing plunger. The expansion lance has a pinching section along a circumferential contour, and the plates to be pinched are arranged between the pinching section and the forming tool. The expansion lance includes a feed bore communicable with a high pressure fluid source. The expansion lance defines an axial stop to abut axial edges of the plates. The axial stop has a radial periphery which is smaller than that of the mold chamber.

Abstract: A device for processing flesh includes at least one transport belt, at least one element for position detection as well as at least one separating device and at least one control device, wherein the separating device communicates via the control device with the element for position detection which provides information to be recorded and processed into geometric data of the flesh and image data of the flesh so that separating cuts based on the geometric and image data can be made with the separating device.