Abstract: A sintering paste may be utilized for the electrically conductive, materially bonded connection of an aluminum conductor covered with an oxide layer to an electronic component. The sintering paste may include nanoscale particles suitable for forming an electrically conductive, materially bonded connection of the aluminum conductor covered with the oxide layer to the electronic component via diffusion under the influence of pressure and temperature.

Abstract: A method for producing an electronic arrangement includes providing an aluminium body and a power electronic unit. The power electronic unit includes a base plate and an electronic component. The method includes pre-treating a joining region of a main surface of the aluminium body; coating the pre-treated joining region with a sinter paste including at least one of copper particles and silver particles; positioning the power electronic unit with a second side of the base plate on the main surface of the aluminium body; joining the power electronic unit and the aluminium body in the joining region with supply of heat, wherein the aluminium body and the power electronic unit are connected via the sinter paste in a materially bonded and heat-transferring manner.

Abstract: A method for producing a heat exchanger is disclosed. The method includes a) providing two heat exchanger plates of the heat exchanger that are to be joined to one another; b) wetting at least one common local joining zone of the two heat exchanger plates with solder; c) forming the heat exchanger by brazing the two heat exchanger plates via local heating of the at least one common joining zone.

Abstract: A method for producing a heat exchanger is disclosed. The method includes a) providing two heat exchanger plates of the heat exchanger that are to be joined to one another; b) wetting at least one common local joining zone of the two heat exchanger plates with solder; c) forming the heat exchanger by brazing the two heat exchanger plates via local heating of the at least one common joining zone.

Abstract: A method for producing a cooling device for cooling a power electronics may include an application step, a preparatory step, and a joining step. The application step may include applying a thin copper layer at least area by area onto a joining side of at least one ceramic plate. The preparatory step may include arranging the at least one ceramic plate with the thin copper layer on at least one of a first upper side of a substantially flat aluminum body and a second upper side of the aluminum body disposed opposite the first upper side. The joining step may include forming a substance-to-substance bond between the joining side of the at least one ceramic plate and the aluminum body via supplying heat.

Abstract: A method for producing an electronic arrangement includes providing an aluminium body and a power electronic unit. The power electronic unit includes a base plate and an electronic component. The method includes pre-treating a joining region of a main surface of the aluminium body; coating the pre-treated joining region with a sinter paste including at least one of copper particles and silver particles; positioning the power electronic unit with a second side of the base plate on the main surface of the aluminium body; joining the power electronic unit and the aluminium body in the joining region with supply of heat, wherein the aluminium body and the power electronic unit are connected via the sinter paste in a materially bonded and heat-transferring manner.

Abstract: A cooling device for cooling power electronics may include a heat-dissipating cooling plate and a contacting surface arranged thereon. The contacting surface may include multiple conductors arranged thereon configured to fix and contact a power electronics. The contacting surface may be electrically insulated from the heat-dissipating cooling plate. Between the heat-dissipating cooling plate and the contacting surface at least one organic intermediate layer may be arranged. The at least one organic intermediate layer may be fixed to the heat-dissipating cooling plate in a firmly bonded manner.

Abstract: A method for producing a cooling device for cooling a power electronics may include an application step, a preparatory step, and a joining step. The application step may include applying a thin copper layer at least area by area onto a joining side of at least one ceramic plate. The preparatory step may include arranging the at least one ceramic plate with the thin copper layer on at least one of a first upper side of a substantially flat aluminum body and a second upper side of the aluminum body disposed opposite the first upper side. The joining step may include forming a substance-to-sub stance bond between the joining side of the at least one ceramic plate and the aluminum body via supplying heat.

Abstract: The invention relates to a method for producing a metal part. Said method comprises the steps of supplying a strand of metal material and applying a coating from a fluxing agent composition to a surface of the strand of material by means of an application device (1), said fluxing agent composition being applied to only a defined portion of the surface of the strand of material by means of the application device (1).

Abstract: A soldered aluminum heat exchanger, having tubes made of a core material through which tubes a coolant flows, and the tubes being connected to at least one header by means of an inner soldered joint; having a protective plating on the inner face of the core material comprising aluminum and using four-layer technology; having an inner solder plating on the protective plating; and having an outer solder plating on the outer face of the tube facing away from the coolant face.

Abstract: A multi-layered brazing sheet with improved long life corrosion resistance achieved by balancing the Zn, Cu, Mn, Si and Mg content of the core and interliner alloy. The brazing sheet has a core of a 3xxx alloy, an inner braze cladding of a 4xxx alloy, and between core and inner braze cladding an interliner of a 3xxx alloy. The 3xxx alloy of the core has 0.55-1.0 wt % Cu, 0.7-1.8 wt % Mn, <0.3 wt % Mg, <0.4 wt % Zn. The 3xxx alloy of the interliner has <0.25 wt % Cu, 0.5-1.5 wt % Mn, <0.3 wt % Mg, 0.1-5.0 wt % Zn. A 1xxx or 7xxx alloy could be used for the interliner instead of the 3xxx alloy.