Abstract: The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 signifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein R2 signifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein R3 signifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein R4 signifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

Abstract: The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 signifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein R2 signifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein R3 signifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein R4 signifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

Abstract: A compound according to formula (I) can be part of a heat-curable resin composition based on polymaleimide resin systems comprising such compound as co-monomer: wherein D is an x-functional group; and x is an integer ?2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. A crosslinked resin is obtainable by curing such composition. The compounds can be used in structural adhesives, matrix resins for fiber prepregs, moulding compounds, and structural and/or electrical composites.

Abstract: The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites.

Abstract: The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

Abstract: A compound according to formula (I) can be part of a heat-curable resin composition based on polymaleimide resin systems comprising such compound as co-monomer: wherein D is an x-functional group; and x is an integer ?2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. A crosslinked resin is obtainable by curing such composition. The compounds can be used in structural adhesives, matrix resins for fiber prepregs, moulding compounds, and structural and/or electrical composites.