Abstract: The present invention relates to chimeric antigen receptors (CAR) comprising an inert and modifiable spacer that evades the off-target binding by Fc receptor (FcR) expressing cells in CAR T cell therapy. The spacer is based on Ig-like C1 domain of signal-regulatory protein alpha.

Abstract: A control circuit configured as a multi-criteria optimizer generates a radiation therapy treatment plan. The circuit then determines a resultant dose distribution as a function of the radiation therapy treatment plan and presents, on a display, at least a part of that resultant dose distribution. The latter may comprise, for example, presenting at least one isodose line on the display. The control circuit then detects user manipulation of a user interface. By one approach, this manipulation does not include corresponding immediate movement of any part of the presented resultant dose distribution itself. In particular, the detected user manipulation does not result in dragged movement of an isodose line on the display.

Abstract: The invention relates to a chemical treatment system for manufacture of paper, board or the like and to a method employing it. The system comprises a first component, which is a glyoxylated polyacrylamide having a net cationic charge density and obtained by glyoxylation of a cationic polyacrylamide base polymer having a weight average molecular weight MW in a range of 30 000-500 000 g/mol. The system further comprises a second component, which comprises a mixture of at least a high-amylopectin starch, and an anionic first polymer, which has a weight average molecular weight MW>200 000 g/mol. The second component has a net cationic charge density in a range from 0.05 meq/g to 0.9 meq/g, when measured at pH 2.8, and a net anionic charge density in a range from ?2 meq/g to ?0.1 meq/g, when measured at pH 7.

Abstract: A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

Abstract: A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

Abstract: The present invention provides a process for forming a contact member cable. The cable is a longer version of a contact member and can then be cut into shorter, individual contact members, to meet the particular requirements for a specific connector application. The contact members can be used as the conductive elements for a family of land grid array connectors that provide, among other things, a low profile, uniform electrical and mechanical performance, and reworkability if a contact member is damaged. The connectors are intended to interconnect electrical circuit members such as printed circuit boards, circuit modules, or the like. Such circuit members may be used in information handling system (computer) or telecommunications environments.

Abstract: An interposer for a land grid array includes a dielectric grid having an array of holes and a resilient, conductive button disposed in one or more of the holes. The button includes an insulating core, a conducting element wound around the insulating core, and an outer shell surrounding the conducting element. The characteristics of the conducting element and the buttons may be chosen such that the contact force and resistance, and compressibility or relaxability of the conductive buttons can be selected within wide limits. Contact areas between the shell and the conducting element urge a substantially corresponding displacement in both the conducting element and the shell when the button is under compression or relaxation. The interposer alternatively can include an insulating sheet and rather than conductive buttons contain conducting elements disposed therein having contact areas with the block.

Abstract: A low insertion force connection using two interfitting components: a tapered element and a beam element which is deformed by the tapered element in the region where the primary forces are buckling, rather than bending. The present invention is based on pressure engaged insert/receptacle type of connections that are self-assembling, and require a minimized insertion force to produce a high and tunable contact force that is not applied through the component to be attached. Apart from differences in size, the same design principles are applicable from the chip level to the board level of a microelectronic system. The invention comprises a low cost pressure engaged electrical and thermal connection, based on insert/receptacle structures in which the contact force and insertion force are separated. Such a design allows tunable contact force while it minimizes the insertion force and allows also for self-assembly and reworkability.

Abstract: Procedure based on X-ray diffraction for measuring the stress state of metals, in particular austenitic steels. In the procedure the detector surface (10) is inclined about an axis (A--A) lying on the surface of the sample (20) being examined which is substantially perpendicular to the direction of the stresses (.sigma..sub.xx) being examined. By means of the detector surface (10) the diameters (2S.sub.ax) of the so-called Debye rings in the direction of the surface being examined are recorded at two or several inclination angles (.psi.). The detector surface (10) has arcuate shape, as viewed in the direction (B--B) at right angles against the inclination axis (A--A), and in the procedure is used such as arcuate detector surface (10) elongated in the direction of said inclination axis (A--A) and narrow enough in the opposite direction that an inclination angle (.psi.) of the detector surface (10) large enough in view of the procedure's implementation is feasible.