Abstract: A testing device (100) is for electrically testing integrated circuits on a wafer (102). The testing device (100) includes a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a radiation shield (107) arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing device (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a hatch (122), and the testing device (100) includes a wafer loading assembly (125) for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the hatch (122).

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, and a radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card. In the testing device, the vacuum chamber is provided with a gate valve, the radiation shield is provided with a hatch, and the testing device comprises a wafer loading assembly for loading the wafer onto the chuck through the gate valve and the hatch.

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

Abstract: A method for a radio channel allocation for telecommunication networks, comprising fixed transceivers (BTS) and fixed or mobile radio stations (MS). The method comprises a step of performing channel allocation for a particular radio connection to a radio station based upon signal to interference estimates for the radio station. A system and a base station controller are also disclosed.

Abstract: A method and apparatus allow large volumes of gas (at least about 10% by volume) to be mixed into a cellulosic fiber suspension having a consistency of about 8-25%. The mixing of ozone containing gas into the suspension is particularly desirable. The suspension is passed into the inlet of a mixer, gas is introduced into the mixer, and the gas and fiber suspension are homogenized by fluidizing the gas and suspension. The flow of suspension through the mixer is throttled so that the effect of the fluctuation and pressure between the inlet and outlet is minimized, and the homogeneously mixed gas and fiber suspension mixture is discharged from mixer outlet.