Abstract: A method of performing an electro-thermo simulation includes defining a non-linear heat diffusion problem for at least a portion of a semiconductor device to be modeled, performing a finite volume discretization of the non-linear heat diffusion problem, reformulating a non-linear term of the discretized non-linear heat diffusion problem to decrease dimensions thereof, performing a hyper reduction of the reformulated non-linear term, and recovering the non-linear heat diffusion problem for the portion of the semiconductor device, and manufacturing the modeled semiconductor device.

Abstract: A method for the automatic design of an electronic circuit includes operations for evaluation of the thermal effects in the electronic circuit. The method generates a layout of the electronic circuit. Abstract data at the substrate level associated to the layout of the electronic circuit is then generated. A grid of partitioning is generated with respect to a view regarding the aforesaid abstract into meshes and nodes. The grid is applied to the substrate. On the basis of the grid (TG), a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of its portions or elements is extracted. The netlist is useful in simulation operations, in particular of a SPICE type, for making an evaluation of thermal effects in the electronic circuit.

Abstract: A method for automatic design of an electronic circuit, includes: generating (100) a layout (L) of the aforesaid electronic circuit; generating (200) abstract data (A) at the substrate level associated to the layout (L) of the aforesaid electronic circuit; generating (300) a grid (TG) of subdivision into meshes and nodes with respect to a view pertaining to the aforesaid abstract (A) and applying it to the aforesaid substrate (SBS); and extracting (400), on the basis of the aforesaid subdivision grid (TG), a full electrical netlist (NC) pertaining to the substrate (SBS). The method further includes performing an evaluation (500, 600) of the interactions between devices (DV) of the electronic circuit at the substrate level according to the aforesaid full electrical netlist (NC) pertaining to the substrate (SBS).

Abstract: A method for the automatic design of an electronic circuit includes operations for evaluation of the thermal effects in the electronic circuit. The method generates a layout of the electronic circuit. Abstract data at the substrate level associated to the layout of the electronic circuit is then generated. A grid of partitioning is generated with respect to a view regarding the aforesaid abstract into meshes and nodes. The grid is applied to the substrate. On the basis of the grid (TG), a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of its portions or elements is extracted. The netlist is useful in simulation operations, in particular of a SPICE type, for making an evaluation of thermal effects in the electronic circuit.

Abstract: A method for automatic design of an electronic circuit, includes: generating (100) a layout (L) of the aforesaid electronic circuit; generating (200) abstract data (A) at the substrate level associated to the layout (L) of the aforesaid electronic circuit; generating (300) a grid (TG) of subdivision into meshes and nodes with respect to a view pertaining to the aforesaid abstract (A) and applying it to the aforesaid substrate (SBS); and extracting (400), on the basis of the aforesaid subdivision grid (TG), a full electrical netlist (NC) pertaining to the substrate (SBS). The method further includes performing an evaluation (500, 600) of the interactions between devices (DV) of the electronic circuit at the substrate level according to the aforesaid full electrical netlist (NC) pertaining to the substrate (SBS).