Abstract: Systems and methods for tote lid hinges are provided. In some embodiments, a tote includes: an interior of the tote; a lid to cover the interior of the tote; and a hinge mechanism configured to be opened in more than one direction. Different applications and use cases of a tote require differences in the opening direction of the tote lid. A flexible hinge mechanism allows the lid to be opened/closed for these various applications using the same hinge & lid design, rather than changing the lid type by application.

Abstract: Systems and methods for thermal management are provided. In some embodiments, a vehicle for transporting one or more actively cooled totes, the vehicle includes: a central heat reject subsystem operable to reject heat from the one or more actively cooled totes; and an attachment mechanism for moving heat from the one or more actively cooled totes to the central heat reject subsystem.

Abstract: A countertop freezer and systems and methods for removing moisture from a refrigeration system are provided. In some embodiments, the countertop freezer includes a bin. In some embodiments, the bin includes a removable insert that is adaptable to the type(s) of products to be sold. In some embodiments, the countertop freezer includes a sliding mechanism that causes the bin to slide outward as the door is opened. In some embodiments, the countertop freezer includes a lighting mechanism on the door that is modular/serviceable and shines light at an angle to allow the product to be illuminated both when the door is closed and when the door is opened.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: Embodiments described herein relate to a thermoelectric cooling system comprising a sealed condensing and evaporating system for the purpose of accepting heat into a heat pumping system. In some embodiments, the sealed condensing and evaporating system includes a heat sink and one or more thermosiphons. Each thermosiphon includes a first portion integrated with the heat sink and a second portion configured to thermally couple to a cold side heat exchange element of a heat exchanger.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.