Abstract: A silver pickling method employing aqueous oxalic acid solutions that removes tightly adherent scale at room temperature, as well as elevated temperatures, that does not tend to plate contaminants onto silver articles due to the accumulation of copper ions in a pickle solution, and that does not aggressively attack solder joints is provided. The silver pickling method comprises the steps of contacting the surface scale of a silver article, such as jewelry, with a solution of oxalic acid and water; maintaining the solution contact with the surface scale for a period of time sufficient to loosen the scale; and removing the surface scale from the article.