Abstract: Thermoformable inks and coatings, such as conductive inks and coatings, are provided. These inks and coatings can be used in printed electronic thermoformed devices. These conductive inks and coatings are suitable to be used as one or more printed layers of a printed electronic device printed with multiple layers of inks and/or coatings (printed stacked array). Methods of fabricating printed electronic devices using the thermoformable inks and coatings are also provided.

Abstract: Compositions used in, and methods for, fabricating a rear-passivated silicon solar cell are described. A novel method of opening the back surface for contacting the silicon with a conventional aluminum paste is described. Various novel screen printable etch resists are described. First, such an etch resist can be printed on the rear of a rear-passivated solar cell wafer. The passivation layer can then be removed using a wet etch, and next the etch resist layer can be removed. Further, an additional wet etch step may optionally be used to deepen the opening into the silicon and enhance the BSF (back-surface field). Aluminum paste can then be printed over the entire backside of the now etched cell. The entire cell is then fired. In exemplary embodiments of the present invention, the paste can be chosen so that it will not fire through the passivation layer.

Abstract: Thermoformable inks and coatings, such as conductive inks and coatings, are provided. These inks and coatings can be used in printed electronic thermoformed devices. These conductive inks and coatings are suitable to be used as one or more printed layers of a printed electronic device printed with multiple layers of inks and/or coatings (printed stacked array). Methods of fabricating printed electronic devices using the thermoformable inks and coatings are also provided.

Abstract: Provided are retort inks containing binder, colorant and carrier, where the cured ink has a bond strength to a layer of retort material of at least about 500 g/2.54 cm before retorting and/or the binder has an endotherm of 0.6 J/g or less or after retorting a bond strength of at least about 375 g/2.54 cm or destruct strength. Laminate plies carrying the ink and retorts using the ink also are provided.

Abstract: Provided are retort inks containing binder, colorant and carrier, where the cured ink has a bond strength to a layer of retort material of at least about 500 g/2.54 cm before retorting and/or the binder has an endotherm of 0.6 J/g or less or after retorting a bond strength of at least about 375 g/2.54 cm or destruct strength. Laminate plies carrying the ink and retorts using the ink also are provided.

Abstract: The composition of an electrode thick film paste used in forming electrical contacts with silicon solar cells is disclosed. The thick film paste is comprised of an electrically conductive metal, an organic vehicle system and a system of inorganic additives. The conductive metal is silver and employs a high surface area material in order to improve fine line printing. The organic system makes use of highly soluble binder materials to enable higher loading of the total resin in the paste that improves the printability and print qualities of fine lines. The improved solubility also broadens the range of thixotropes that can be used to further improve printed line properties. In the organic system, a high surface tension solvent is used to improve line quality metrics such as ‘aspect ratio’. The inorganic glass and additives include compounds of lead, tellurium and thallium that improve the electrode contact to, and light conversion efficiency of, the silicon solar cell.

Abstract: Compositions used in, and methods for, fabricating a rear-passivated silicon solar cell are described. A novel method of opening the back surface for contacting the silicon with a conventional aluminum paste is described. Various novel screen printable etch resists are described. First, such an etch resist can be printed on the rear of a rear-passivated solar cell wafer. The passivation layer can then be removed using a wet etch, and next the etch resist layer can be removed. Further, an additional wet etch step may optionally be used to deepen the opening into the silicon and enhance the BSF (back-surface field). Aluminum paste can then be printed over the entire backside of the now etched cell. The entire cell is then fired. In exemplary embodiments of the present invention, the paste can be chosen so that it will not fire through the passivation layer.

Abstract: Formulations for solvent-based flexographic or rotogravure inks, which are capable high-quality, defect-free printing at high speeds, contain flexographic ink resins solutions and solvent mixtures which are designed to maintain a dynamic solubility parameter in the ink as the dry state is approached during the printing process. The inks described show extremely high quality printing at linear press speeds above 1800 fee per minute (ca 0.549 km/min).

Abstract: Provided are retort inks containing binder, colorant and carrier, where the cured ink has a bond strength to a layer of retort material of at least about 500 g/2.54 cm before retorting and/or the binder has an endotherm of 0.6 J/g or less or after retorting a bond strength of at least about 375 g/2.54 cm or destruct strength. Laminate plies carrying the ink and retorts using the ink also are provided.

Abstract: Formulations for solvent-based flexographic or rotogravure inks, which are capable high-quality, defect-free printing at high speeds, contain flexographic ink resins solutions and solvent mixtures which are designed to maintain a dynamic solubility parameter in the ink as the dry state is approached during the printing process. The inks described show extremely high quality printing at linear press speeds above 1800 fee per minute (ca 0.549 km/min).

Abstract: A retort ink contains binder, colorant and carrier and the cured ink has a bond strength to a layer of retort material of at least about 500 g/2.54 cm before retorting and/or the binder has an endotherm of 0.6 J/g or less or after retorting a bond strength of at least about 375 g/2.54 cm or destruct strength. Laminate plies carrying the ink and retorts using the ink are described.