Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article including a bonded abrasive body having a certain Homogeneity Factor and a multimodal distribution of abrasive particle sizes where the particles size of a first mode is no greater than 80% of a particle size of a second mode. The bonded body can also have a consistent hardness throughout the body.

Abstract: An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value, and the minimum content is greater than 0.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value, and the minimum content is greater than 0.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450° C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

Abstract: Embodiments of the present invention relate to a reclaimed wafer, a method for reclaiming a wafer, a method for reclaiming a batch of wafers, and a method for forming electronic structures. After being reclaimed, the reclaimed wafers are essentially free of a residue.