Patents by Inventor Maureen Breiling

Maureen Breiling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated apparatus to temporarily attach substrates to carriers without adhesives for processing
    Patent number: 10665494
    Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 26, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Niranjan Kumar, Seshadri Ramaswami, Shay Assaf, Amikam Sade, Andy Constant, Maureen Breiling
  • AUTOMATED APPARATUS TO TEMPORARILY ATTACH SUBSTRATES TO CARRIERS WITHOUT ADHESIVES FOR PROCESSING
    Publication number: 20190237352
    Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.
    Type: Application
    Filed: January 31, 2018
    Publication date: August 1, 2019
    Inventors: Niranjan KUMAR, Seshadri RAMASWAMI, Shay ASSAF, Amikam SADE, Andy CONSTANT, Maureen BREILING