Abstract: Apparatus and method for continuous electroplating of at least first and second selected portions of an electronic component or the like, while effecting differential plating thicknesses upon said portions. The apparatus includes means for moving the components through an electroplating station with the portions selected to be plated in contact with a moving applicator belt. Means are provided for shunting a portion of the plating current preceding toward at least one of the selected portions of the component, back to the source which enables the plating potential, whereby differential plating is effected between the first and second portions of the component.

Abstract: Apparatus for continuous electroplating of selected portions of discrete electronic components. The components are carried by a conveyor belt through an electroplating station where the portions to be plated make contact with a moving porous applicator surface wetted with the electroplating solution, while a D.C. potential is suitably applied. The respective movements of conveyor and applicator surfaces are such that the trace of each conveyed component upon the applicator surface continuously overlies fresh electroplating solution. The conveyor belt passes through a channel in a stationary guide means at the electroplating station, which accurately spaces the components with respect to the applicator and restrains the components from undesired wobble or vertical movements. The leads of the components, which are connected to electrically isolated terminals on the die-receiving face of the component, protrude from the guide as they progress through the channel therein.