Patents by Inventor Maurice Clair

Maurice Clair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10237984
    Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.
    Type: Grant
    Filed: May 27, 2013
    Date of Patent: March 19, 2019
    Assignee: 3D-Micromac AG
    Inventors: Tino Petsch, Maurice Clair, Alexander Böhm, Martin Sachse
  • Patent number: 9974189
    Abstract: A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second region
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: May 15, 2018
    Assignee: 3D-Micromac AG
    Inventors: Frank Allenstein, Maurice Clair, Tino Petsch, Rocco Kundt
  • Publication number: 20160212858
    Abstract: A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second region
    Type: Application
    Filed: August 8, 2014
    Publication date: July 21, 2016
    Inventors: Frank Allenstein, Maurice Clair, Tino Petsch, Rocco Kundt
  • Publication number: 20150144379
    Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.
    Type: Application
    Filed: May 27, 2013
    Publication date: May 28, 2015
    Applicant: 3D- Micromac AG
    Inventors: Tino Petsch, Maurice Clair, Alexander Böhm, Martin Sachse