Patents by Inventor Maurice E. Dumesnil
Maurice E. Dumesnil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 5281561Abstract: A low temperature sealing glass composition suitable for sealing integrated circuit alumina packages at temperatures below 400.degree. C. in a short time of about ten minutes. This sealing glass composition is a mixture of a glass powder and 1 to 50% (by weight) of one or more low expansion ceramic powders. The glass powder comprises a lead borate or lead zinc borate glass and the joint addition of Cu.sub.2 O, Tl.sub.2 O and F in a range of 6.3 to 20% (by weight) wherein the molar ratio of Cu to Tl to F is in the range between 0.8 Cu: 0.8 Tl: 0.8 F to 1.2 Cu: 1.2 Tl: 1.2 F. The glass in powder form is blended with one or more compatible low expansion ceramic powders including cordierite, zircon, willemite, lead titanate or modified tin oxide.Type: GrantFiled: February 9, 1993Date of Patent: January 25, 1994Inventors: Maurice E. Dumesnil, Leo Finkelstein
-
Patent number: 5188990Abstract: Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.Type: GrantFiled: November 21, 1991Date of Patent: February 23, 1993Assignee: VLSI Packaging MaterialsInventors: Maurice E. Dumesnil, Leo Finkelstein
-
Patent number: 5013360Abstract: Fluid, stable glasses useful for low-temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, phosphorus pentoxide, titania and/or zirconium oxide to the lead oxide vanadium oxide binary. The phosphorus pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum oxide.Sealing glass compositions comprising these low-melting lead-vanadia glasses in powder form and refractory fillers of lower thermal expansion for use in hermetically sealing semiconductor devices in ceramic packages are disclosed. Group V metal oxides, particularly niobium-containing oxides, are preferred fillers. Silver metal is a preferred filler for making die-attach compositions.Type: GrantFiled: September 15, 1989Date of Patent: May 7, 1991Assignee: VLSI Packaging Materials, Inc.Inventors: Leo Finkelstein, Maurice E. Dumesnil, Richard R. Tetschlag
-
Patent number: 4997718Abstract: Extremely low-melting oxide glasses useful in silver/glass die-attach materials are disclosed. These glasses are composed of silver oxide, phosphorus oxide and a third component comprising PbO, CdO, ZnO or combination thereof. Their melting point lies in the 200.degree.-300.degree. C. range.Type: GrantFiled: November 8, 1989Date of Patent: March 5, 1991Assignee: VLSI Packaging Materials, Inc.Inventors: Maurice E. Dumesnil, Leo Finkelstein
-
Patent number: 4743302Abstract: Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.Type: GrantFiled: January 20, 1987Date of Patent: May 10, 1988Assignee: VLSI Packaging Materials, Inc.Inventors: Maurice E. Dumesnil, Leo Finkelstein
-
Patent number: 4699888Abstract: A silver-glass composition for use in attaching a semiconductor support and a method for making the attachment are disclosed. The glass component of the composition is a low melting point glass comprising about 75-85 wt. % lead oxide, about 8-15% boron oxide, about 0.75 to 2.5 wt. % silicon-dioxide, 0-10 wt. % zinc oxide, 0 to 3 wt. % alumina, 0.5 to 5.5 wt. % cuprousoxide and a non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1.0:0.25 to 1.0:10. The weight ratio of silver to glass in the composition is in the range about 2:1 to 9:1.Type: GrantFiled: September 16, 1985Date of Patent: October 13, 1987Assignee: Technology Glass CorporationInventors: Maurice E. Dumesnil, Karl Starz, Leonid Finkelshteyn
-
Patent number: 4251595Abstract: Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, up to 5% by weight bismuth oxide and from 0.1 to 5.0% alumina are disclosed. These glasses are mixed with particulate lead titanate in amounts up to about 56% by volume. These mixtures have very low coefficients of thermal expansion and are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.Type: GrantFiled: September 10, 1979Date of Patent: February 17, 1981Assignee: Technology Glass CorporationInventors: Maurice E. Dumesnil, Ulrich Schreier
-
Patent number: 4186023Abstract: Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, and up to 5% by weight bismuth oxide. These glasses may be mixed with particulate refractory fillers in amounts up to about 56% by volume. The sealing glasses are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.Type: GrantFiled: May 1, 1978Date of Patent: January 29, 1980Assignee: Technology Glass CorporationInventors: Maurice E. Dumesnil, Ulrich Schreier
-
Patent number: 4002799Abstract: Sealed semiconductor packages and the like and a method of making them are described. The sealant compositions employed are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boran glasses in which the zinc-lead mol ratio is below 1:2.Type: GrantFiled: February 17, 1976Date of Patent: January 11, 1977Assignee: Technology Glass CorporationInventors: Maurice E. Dumesnil, Ulrich Schreier
-
Patent number: 3963505Abstract: Sealing compositions suitable for sealing semi-conductor packages and the like at temperatures below about 450.degree.C. The compositions are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boron glasses in which the zinc-lead mol ratio is below 1:2.Type: GrantFiled: November 23, 1973Date of Patent: June 15, 1976Assignee: Technology Glass CorporationInventors: Maurice E. Dumesnil, Ulrich Schreier