Abstract: A solution of monomers, oligomers or polymers and a suitable oxidation agent can be stable if the solution also comprises a base. By spin coating this solution onto a substrate, a layer can be formed which, after patterned irradiation, yields a pattern of a doped conductive polymer which is formed in situ, the exposed and unexposed areas exhibiting a large difference in conductivity. A description is given of, inter alia, the patterned irradiation of a layer of 3,4-ethylenedioxythiophene. If desired, the conductive polymer pattern can subsequently be metallized in an electroplating bath. The method provides, inter alia, a simple process of manufacturing metal patterns on insulating substrates, such as printed circuit boards.

Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./sqaure. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.