Patents by Inventor Maurice M. Karnowsky

Maurice M. Karnowsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder extrusion pressure bonding process and bonded products produced thereby
    Patent number: 5121871
    Abstract: Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.
    Type: Grant
    Filed: April 20, 1990
    Date of Patent: June 16, 1992
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Leonard C. Beavis, Maurice M. Karnowsky, Frederick G. Yost
  • Mercury switch with non-wettable electrodes
    Patent number: 4652710
    Abstract: A mercury switch device comprising a pool of mercury and a plurality of electrical contacts made of or coated with a non-wettable material such as titanium diboride.
    Type: Grant
    Filed: April 9, 1986
    Date of Patent: March 24, 1987
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Maurice M. Karnowsky, Frederick G. Yost