Abstract: The polishing pad is useful in chemical mechanical polishing. The polishing pad includes a polishing portion having a top polishing surface and a polishing material. There is an opening through the polishing pad and a transparent window within the opening. The transparent window is secured to the polishing pad. The window includes a polyurethane composition formed by reacting, in the presence of a hard segment inhibitor for reducing size of hard segment domains, a polymeric polyol, a polyisocyanate and a curing agent. The curing agent includes three or more hydroxyl groups forming hard segments and the polyurethane composition is an amorphous mixture of hard segments in a soft segments matrix and is free of carbon-carbon double bonds.

Abstract: A polishing pad useful in chemical mechanical polishing comprising a polishing portion having a top polishing surface and comprising a polishing material an opening through the polishing pad, and a transparent window within the opening in the polishing pad, the transparent window being secured to the polishing pad and being transparent to at least one of magnetic and optical signals, the transparent window having a thickness and a top surface having a plurality of elements separated by interconnected recesses to provide a pattern in the top surface that includes recesses for improved deflection into a cavity in the polishing pad during polishing.

Abstract: A chemical mechanical polishing pad having two or more end point detection windows can be made by providing a structure that includes a polishing layer having a top surface defining a horizontal direction, a bottom surface, and two or more apertures extending from the top surface to the bottom surface wherein each of the two or more apertures has a transparent window located in the aperture, wherein each of the windows has a portion extending outward from the bottom surface of the polishing layer, wherein the two or more apertures are located at select distance from each other, applying a subpad material on the bottom surface and the portion of the windows extending outward from the bottom surface, and revealing the windows by removing a portion of the subpad material and wherein the two or more apertures remain at the select distance from each other.

Abstract: The polishing pad is useful in chemical mechanical polishing. The polishing pad includes a polishing portion having a top polishing surface and a polishing material. There is an opening through the polishing pad and a transparent window within the opening. The transparent window is secured to the polishing pad. The window includes a polyurethane composition formed by reacting, in the presence of a hard segment inhibitor for reducing size of hard segment domains, a polymeric polyol, a polyisocyanate and a curing agent. The curing agent includes three or more hydroxyl groups forming hard segments and the polyurethane composition is an amorphous mixture of hard segments in a soft segments matrix and is free of carbon-carbon double bonds.

Abstract: The invention provides a polishing pad suitable for polishing integrated circuit wafers. It includes an upper polishing layer that having a polishing surface and at least one groove in the upper polishing layer. At least one transparent window is located within the upper layer. The at least one transparent window has a thickness greater than a desired wear depth of the at least one groove. The at least one transparent window includes a non-fluorescent transparent polymer; and a fluorescent transparent polymer. The transparent window allows measuring groove depth by activating the fluorescent transparent polymer with an activation source at a wavelength sufficient to excite the fluorescent transparent polymer and allow endpoint detection by sending light through the fluorescent transparent polymer and the non-fluorescent transparent polymer.

Abstract: A polishing pad useful in chemical mechanical polishing comprising a polishing portion having a top polishing surface and comprising a polishing material an opening through the polishing pad, and a transparent window within the opening in the polishing pad, the transparent window being secured to the polishing pad and being transparent to at least one of magnetic and optical signals, the transparent window having a thickness and a top surface having a plurality of elements separated by interconnected recesses to provide a pattern in the top surface that includes recesses for improved deflection into a cavity in the polishing pad during polishing.

Abstract: The invention provides a polishing pad suitable for polishing integrated circuit wafers. A polyurethane polishing layer has a top surface and at least one groove in the polyurethane polishing layer. At least one copolymer wear detector located within the polyurethane polishing layer detects wear of the polishing layer adjacent the at least one groove. The at least one wear detector includes two regions, a first region being a fluorescent acrylate/urethane copolymer linked with a UV curable linking group and a second non-fluorescent region, The wear detector allows detecting wear of the polishing layer.

Abstract: The invention provides a polishing pad suitable for polishing integrated circuit wafers. It includes an upper polishing layer that having a polishing surface and at least one groove in the upper polishing layer. At least one transparent window is located within the upper layer. The at least one transparent window has a thickness greater than a desired wear depth of the at least one groove. The at least one transparent window includes a non-fluorescent transparent polymer; and a fluorescent transparent polymer. The transparent window allows measuring groove depth by activating the fluorescent transparent polymer with an activation source at a wavelength sufficient to excite the fluorescent transparent polymer and allow endpoint detection by sending light through the fluorescent transparent polymer and the non-fluorescent transparent polymer.

Abstract: The invention provides a polishing pad suitable for polishing integrated circuit wafers. A polyurethane polishing layer has a top surface and at least one groove in the polyurethane polishing layer. At least one copolymer wear detector located within the polyurethane polishing layer detects wear of the polishing layer adjacent the at least one groove. The at least one wear detector includes two regions, a first region being a fluorescent acrylate/urethane copolymer linked with a UV curable linking group and a second non-fluorescent region, The wear detector allows detecting wear of the polishing layer.