Abstract: The present invention relates to a level shifter circuit (20) for transistors requiring high voltage, such as nonvolatile memories. In the circuit configuration, the drain- to-source voltage across the NMOS transistors (Q1, Q4) can be substantially equal to the power supply voltage (VPP) according to the input voltage level at the complementary input terminals (IN, INB). For alleviating such a voltage stress, the source potential of each NMOS transistor is increased according to the input voltage level. Thus, the source of the transistor at the OUT side is biased by the input signal at the input terminal (IN) and the source of the transistor at the IN side is biased by the complementary input signal at the corresponding terminal (INB). Hot-carrier degradation and leakage of the load current flowing through from the power supply voltage (VPP) to the reference voltage (VSS) can be then reduced.

Abstract: A high voltage driver circuit for devices such as non-volatile memories, in which a low voltage driver is combined in two different ways with a high voltage driver In one, input-independent embodiment, a low voltage driver (Q7, Q8) is connected directly in parallel with a high voltage driver, thereby providing a high voltage signal path for high voltage operations and a low voltage signal path for low voltage operations. In an alternative, partially input-dependent embodiment, a low voltage driver is connected to the output of a high voltage driver (Q9, Q10), which may comprise a partial level shifter (Q1 B Q6). The output of this low voltage driver (Q9, Q10), which forms the output terminal of the entire stage, has a pull up/pull down transistor (Q11), depending on whether the partial level shifter (Q1 B Q6) is a positive or negative level shifting high voltage driver.

Abstract: A non-volatile, random access memory cell comprises first and second inverters each having an output node cross-coupled by cross-coupling means to an input node of the other inverter for forming a MOS RAM cell. The output node of each inverter is selectively connected via the conductor paths of separate access transistors to respective bit lines. The control electrodes of the access transistors are connected to a common word line. In particular, both RAM and programmable Read-Only operation of said memory cell are provided. Thereto, the cross-coupling comprises capacitors (C1, C2) each in series with a control electrode of a respective p-type transistor of the first and second inverters. This renders both interconnecting nodes between a capacitor and the gate electrode of its associated p-channel transistor floating. Isolators around these nodes render the cell data-retentive. The nodes are transiently and electrically programmable through signals on the bit and word lines of the cell.