Abstract: In order to focus the beam of a laser onto a receiving end of an optical fiber substantially coaxial therewith, the laser output is formed by a planoconvex lens with a semitransparent flat face confronting the laser cavity and an antireflecting curved face turned toward the fiber. Alignment of the laser beam with the fiber axis is accomplished by the adjustment of two oppositely pointing juxtaposed wedges interposed between the lens and the laser.

Abstract: A method of making semiconductor devices passivated by an integrated heat sink comprises a layer-by-layer buildup of a silicon-based laminate, the creation of Mesa structures on one face of the laminate and of dissipator seats on the other face of the laminate by marking and etching processes, carrying out electrolytic growth of silver thermal dissipators and forming a metallic sheet and adhering same only to a selected exposed silicon N area.

Abstract: A process for producing a semiconductor device with an integral heatsink involving applying a coating of dielectric to a sheet of semiconductor material, removing part of the dielectric coating by etching to leave specific sink zones, coating the zones with a metal layer, bonding the assembly to a support with adhesive, depositing a layer of metal to the non-adhered surface of the semiconductor sheet in areas corresponding to the sink zones, and removing semiconductor material from the body of the sheet between the sink zones to produce mesa profile units with heatsinks.