Patents by Inventor Mauro Lai

Mauro Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150085458
    Abstract: Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Inventors: Raul Enriquez Shibayama, Mauro Lai, Richard K. Kunze, Nicholas B. Peterson, Carlos A. Lizalde Moreno, Kai Xiao
  • Publication number: 20140174812
    Abstract: A method of reducing crosstalk. The method may include forming a first contact over a first vertical conductor. The method may include forming a second contact over a second vertical conductor. The method may include forming a third contact over a third vertical conductor. The method may include forming a capacitive coupler between the first contact, the second contact, and the third contact, wherein the capacitive coupler is to cancel crosstalk received at the second vertical conductor and third vertical conductor from the first vertical conductor.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventors: Raul Enriquez Shibayama, Kai Xiao, Nicte A. Zavala Castro, Mauro Lai, Yanjie Zhu