Patents by Inventor Mauro Nicola

Mauro Nicola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TOOL TO CUT OUT A PORTION OF THE CORE FOAM FROM A SIP PANEL
    Publication number: 20240131741
    Abstract: Tool to scoop out the foam from a SIP panel that complies with the industry safety requirements, it is easy to use, and can be easily adjusted to different types and sizes of SIP panels. The tool to cut out a portion of the core foam from a sip panel, comprising: a power unit; a support frame attached to the power unit; an adjustable guiding unit attached to the support frame; and a scooping unit.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventor: Mauro Nicolas Querejeta
  • High power semiconductor module
    Patent number: 7005739
    Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: February 28, 2006
    Assignee: ABB Schweiz AG
    Inventors: Stefan Kaufmann, Thomas Lang, Egon Herr, Mauro Nicola, Soto Gekenidis
  • High power semiconductor module
    Publication number: 20040207070
    Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.
    Type: Application
    Filed: June 10, 2004
    Publication date: October 21, 2004
    Inventors: Stefan Kaufmann, Thomas Lang, Egon Herr, Mauro Nicola, Soto Gekenidis