Abstract: Tool to scoop out the foam from a SIP panel that complies with the industry safety requirements, it is easy to use, and can be easily adjusted to different types and sizes of SIP panels. The tool to cut out a portion of the core foam from a sip panel, comprising: a power unit; a support frame attached to the power unit; an adjustable guiding unit attached to the support frame; and a scooping unit.

Abstract: A brick clip to build double walls in a construction site, comprising a base from one face of which at least two projections capable of being inserted into the holes of a hollow brick are projected. The base is flat and has an X shape defining two right side arms and two left side arms. At each end of the arms of the X-shaped base a cylindrical projection protrudes, and at the center of the X-shaped base two parallel elongated projections protrudes. The cylindrical projections of the right side arms are inserted into the holes of one hollow brick, the cylindrical projections of the left side arms are capable of being inserted in the holes of another hollow brick, and the elongated projections are capable of defining a separation partition that keep the distance between the two bricks.

Abstract: Tool to scoop out the foam from a SIP panel that complies with the industry safety requirements, it is easy to use, and can be easily adjusted to different types and sizes of SIP panels. The tool to cut out a portion of the core foam from a sip panel, comprising: a power unit; a support frame attached to the power unit; an adjustable guiding unit attached to the support frame; and a scooping unit.

Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.

Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.