Abstract: Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

Abstract: A cooled electronic circuit board (10) comprising: a support circuit board (11) equipped with sockets (12a, 12b, 12c) mutually alongside each other for DIMM storage modules (13); DIMM storage modules (13) each equipped with a plug (14) which can be coupled with one of the sockets (12a, 12b, 12c); two supports (15, 16) for storage modules (13), having respective channels (17) for the passage of a cooling liquid; thermal conduits (18) connected to the channels (17), each located between two adjacent sockets (12a, 12b, 12c) of the support circuit board (11); heat diffusers (19) each equipped with two walls (20, 21) each covering a side of one of the storage modules (13). The heat diffusers (19) are designed in such a way that, in use, two of the adjacent heat diffusers are in mutual thermal contact and in thermal contact with the thermal conduits (18) and with the supports (15, 16).

Abstract: Heat dissipation device for an electronic board comprising a support body connected to the electronic board, said electronic board being provided with an electric connection interface which can be inserted into/extracted from an electric connector provided in a direction orthogonal with respect to the lying plane of a support plate, having a heat dissipation surface configured to dissipate the heat transmitted to it by thermal conduction, wherein said heat dissipation device comprises at least one holding element and a leveling member, coordinated with respect to each other in order to position a surface of the support body in contact with the heat dissipation surface of the support plate.

Abstract: Heat dissipation device for an electronic board comprising a support body connected to the electronic board, said electronic board being provided with an electric connection interface which can be inserted into/extracted from an electric connector provided in a direction orthogonal with respect to the lying plane of a support plate, having a heat dissipation surface configured to dissipate the heat transmitted to it by thermal conduction, wherein said heat dissipation device comprises at least one holding element and a levelling member, coordinated with respect to each other in order to position a surface of the support body in contact with the heat dissipation surface of the support plate.

Abstract: Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

Abstract: A cooled electronic circuit board (10) comprising: a support circuit board (11) equipped with sockets (12a, 12b, 12c) mutually alongside each other for DIMM storage modules (13); DIMM storage modules (13) each equipped with a plug (14) which can be couple with one of the sockets (12a, 12b, 12c); two supports (15, 16) for storage modules (13), having respective channels (17) for the passage of a cooling liquid; thermal conduits (18) connected to the channels (17), each located between two adjacent sockets (12a, 12b, 12c) of the support circuit board (11); heat diffusers (19) each equipped with two walls (20, 21) each covering a side of one of the storage modules (13). The heat diffusers (19) are designed in such a way that, in use, two of the adjacent heat diffusers are in mutual thermal contact and in thermal contact with the thermal conduits (18) and with the supports (15, 16).

Abstract: The present invention relates to the use of an enzymatic method for treating flour, semolina and protein extracts derived from cereals known to stimulate a pathological immune response in patients affected by Celiac Disease (CD). Said treatment drastically reduces or completely eliminates the toxicity of gluten or similar products derived from other cereals. The method uses the catalytic activity of microbial transglutaminase and, in particular, its ability to bind proteins in cereal flour or semolina to an alkylated (C1-C4) derivative of lysine. After the treatment said proteins extracted from flour show a substantially lowered immuno-stimulatory activity in celiac patients T lymphocytes.

Abstract: Cooled electronic board (10) for supercomputing comprising: a printed electronic circuit (11) whereon at least a electronic component (12) is fixed; a heat exchanger (13) of the roll bond type thermally connected with the electronic component (12) to absorb, in use, a thermal flow generated by the latter.

Abstract: A modular super-calculation architecture comprises a plurality of electronic calculation modules communicating with each other in a network and liquid cooled. Each electronic calculation module includes a calculation node, one or more autonomous liquid cooling devices, an electric power device, a box-like container that encloses and protects inside it at least the calculation node, the electric power device, and the one or more liquid cooling devices. Each electronic calculation module is independent hydraulically, electrically, in terms of network communication and mechanically at least from the other electronic calculation modules, and can be inserted and/or removed or substituted hot from said architecture.

Abstract: Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.

Abstract: A network architecture is used for the communication between elementary calculus units or nodes of a supercomputer to execute a super-calculus processing application, partitionable and scalable at the level of calculus power in the range of PetaFLOPS. The supercomputer comprises a plurality of modular structures, each of which comprises a plurality of elementary calculus units or nodes defined by node cards a backplane, a root card, and a node communication network of the switched fabric fat tree type; ii) a synchronization architecture comprising a plurality of distinct node communication networks, configured for the communication of specific synchronization information different from network to network and with different characteristics; iii) a re-configurable Programmable Network Processor that implements the nodes both of the n-toroidal network and those of the synchronization networks.

Abstract: A network architecture is used for the communication between elementary calculus units or nodes of a supercomputer to execute a super-calculus processing application, partitionable and scalable at the level of calculus power in the range of PetaFLOPS. The supercomputer comprises a plurality of modular structures, each of which comprises a plurality of elementary calculus units or nodes defined by node cards, a backplane, a root card, and a node communication network of the switched fabric fat tree type; ii) a synchronization architecture comprising a plurality of distinct node communication networks, configured for the communication of specific synchronization information different from network to network and with different characteristics; iii) a re-configurable Programmable Network Processor that implements the nodes both of the n-toroidal network and those of the synchronization networks.

Abstract: Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.

Abstract: A wearable containing element for an electronic apparatus, comparable to an ornament or pendant, comprising at least a pair of complementary shells, able to be coupled with each other so as to define a containing body with an external surface having a shape and size comparable to those of a traditional ornament, and an internal containing compartment, of a shape and size sufficiently large to house the electronic apparatus.

Abstract: The present invention relates to the use of an enzymatic method for treating flour, semolina and protein extracts derived from cereals known to stimulate a pathological immune response in patients affected by Celiac Disease (CD). Said treatment drastically reduces or completely eliminates the toxicity of gluten or similar products derived from other cereals. The method uses the catalytic activity of microbial transglutaminase and, in particular, its ability to bind proteins in cereal flour or semolina to an alkylated (C1-C4) derivative of lysine. After the treatment said proteins extracted from flour show a substantially lowered immuno-stimulatory activity in celiac patients T lymphocytes.

Abstract: A seat, especially an aircraft passenger seat, has seat components such as a seat part, a seat back (3), and a shell body (5). The shell body forms at least a partially rear enclosure (9) of the seat part and the seat back (3). With an adjusting mechanism, the seat part and the seat back (3) can be adjusted in position relative to one another and relative to the rear enclosure (9). The distance between the rear enclosure and the seat back (3) is variable. A cover assembly (31, 45) bridges a distance formed by the variable distance between the seat back (3) and enclosure (9) between formed gaps.

Abstract: A wearable containing element for an electronic apparatus, comparable to an ornament or pendant, comprising at least a pair of complementary shells, able to be coupled with each other so as to define a containing body with an external surface having a shape and size comparable to those of a traditional ornament, and an internal containing compartment, of a shape and size sufficiently large to house the electronic apparatus.

Abstract: A method of creating a system for haptically and graphically rendering one or more scenes. The method includes generating one or more haptic targets for haptically rendering the scene as a virtual scene. The scene is haptically rendered as the virtual scene. The method also includes providing one or more graphics targets for graphically rendering the scene as a graphical scene, generating an initial data packet for the scene, and transmitting the initial data packet to the graphics target. The method also includes loading the initial data packet on the graphics target to create the graphical scene.

Abstract: Multilayer expansion card for connecting an apparatus or device to an electronic apparatus, particularly for association to a mother card of a Personal Computer. The card comprises a first part, intended principally for connection, having a thickness coherent with the requirements of size for connection to the standard slots of the mother card, and a second part, intended principally for the management of the card functions and for processing, and hence the electronics, having a greater thickness with respect to the first part in order to contain a correspondingly greater number of layers intended for the management of a high density of electronic-type signals.

Abstract: In a seat, especially an aircraft passenger seat, with seat components such as for example a seat part, a seat back (3), and a shell body (5) which forms at least a partially rear enclosure (9) of the seat part and the seat back (3), and with an adjusting means by which the seat part and the seat back (3) can be adjusted in position relative to one another and relative to the rear enclosure (9), with the distance between the latter and the seat back (3) being variable, there is present a cover means (31, 45) for bridging a distance which is formed by the variable distance between the seat back (3) and enclosure (9) between these formed gaps.