Abstract: The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N?2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Abstract: The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N?2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Abstract: The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N?2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Abstract: The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N?2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Abstract: An electronic circuit card comprises a printed circuit board with electronic components. The electronic components comprise drivers for transmitting transmit (TX) signals and receivers for receiving receive (RX) signals, according to several groups of interface signals. There is further provided a connector edge, arranged at an edge of the card, and configured to allow the card to be connected to an external connector. This connector edge comprises two subsets of symmetric pins on respective (opposite) sides thereof. The drivers and the receivers are connected to the pins, for respectively conveying the TX signals and the RX signals. Pins are assigned such that, for each of the several groups of supported interface signals, any pin (of any of the subsets) connected to transmit TX signals is located opposite a pin (of the other subset) connected to receive RX signals. Pairs of consecutive pins (on each side) typically come in differential pairs.

Abstract: An electronic circuit card comprises a printed circuit board (PCB) with electronic components thereon. The electronic components comprise drivers for transmitting TX signals and receivers for receiving RX signals, according to several groups of interface signals. There is further provided a connector edge, arranged at an edge of the card, and configured to allow the card to be connected to an external connector. This connector edge comprises two subsets of symmetric pins on respective (opposite) sides thereof. The drivers and the receivers are connected to the pins, for respectively conveying the TX signals and the RX signals. Pins are assigned such that, for each of the several groups of supported interface signals, any pin (of any of the subsets) connected to transmit TX signals is located opposite a pin (of the other subset) connected to receive RX signals. Pairs of consecutive pins (on each side) typically come in differential pairs.

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.

Abstract: A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Abstract: A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.

Abstract: A power supply structure for high power circuit package is disclosed. According to the invention, the electrical connections between power planes are done through a plurality of coaxial structures that can be totally or partially implemented in the circuit shadow area of the electronic device carrier, for example under the engine area of the circuit. According to this principle, a same hole is used to transfer two different current levels, one on its periphery and the other one on its centre, doubling the electrical transfer capacity.

Abstract: A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.

Abstract: A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Abstract: A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis. In a preferred embodiment, the shape of these aligned conductive tracks looks like a disk or an annular ring and four vias are used to connect two adjacent conductive layers. These four vias are symmetrically disposed on each of said conductive track.

Abstract: A coaxial via structure adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier is provided. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.