Abstract: Disclosed is a grounded receptacle assembly for mounting to a panel having a grounded conductive surface. The receptacle assembly includes a housing having a mounting face and a discontinuous array of spaced-apart clip members disposed about the mounting face, so as to be slidingly received in a wall of the receptacle housing. Each clip member includes a first end with a resilient tongue disposed within the housing cavity and has a second end with outwardly extending contact fingers that engage the conductive panel surface when the recptacle housing is mounted thereto. The mounting face is aligned with a plug receiving opening formed in the panel, so that a shielded plug connector can be received within the receptacle housing. When inserted within the receptacle assembly, the plug shield, which is located on an exterior surface of the plug body engages the resilient tongue so as to be electrically coupled to the grounded panel surface.