Abstract: A PCB analysis utilizes manufacturing capability data shared in a multi-tenant collaborative network in a mixed cloud and on-premise environment. Access to a tenant's account of a DFM application deployed on the tenant's premises is provided. The DFM application is enabled to activate the PCB analysis on a DFM profile with manufacturing capability data. The tenant's account requests a utilization authorization of a given DFM profile stored in a cloud data layer. When the utilization is authorized, the given DFM profile is downloaded embedded in a locked DFM envelope, which locks together the given DFM profile with an injected identifier of the authorized tenant's account. Via the DFM application, when logged into the tenant's account, the PCB analysis is activated by permitting the unlocking of the DFM profile from the DFM envelope only when the identifier of the tenant's account is the same as the injected identifier.

Abstract: A PCB analysis utilizes manufacturing capability data shared in a multi-tenant collaborative network in a mixed cloud and on-premise environment. Access to a tenant's account of a DFM application deployed on the tenant's premises is provided. The DFM application is enabled to activate the PCB analysis on a DFM profile with manufacturing capability data. The tenant's account requests a utilization authorization of a given DFM profile stored in a cloud data layer. When the utilization is authorized, the given DFM profile is downloaded embedded in a locked DFM envelope, which locks together the given DFM profile with an injected identifier of the authorized tenant's account. Via the DFM application, when logged into the tenant's account, the PCB analysis is activated by permitting the unlocking of the DFM profile from the DFM envelope only when the identifier of the tenant's account is the same as the injected identifier.

Abstract: This application discloses a computing system to parse a product model definition that includes a layout design of a printed circuit board assembly, which identifies physical design characteristics of the layout design of the printed circuit board assembly. The computing system can identify one or more manufacturing processes capable of manufacturing at least a portion of the printed circuit board assembly having the identified physical design characteristics. The computing system can include a map or correlation between the manufacturing processes and manufacturing-related design constraints. The computing system can select one or more manufacturing checks that define manufacturing-related design constraints correlated to the identified manufacturing processes.

Abstract: This application discloses a computing system to parse a product model definition that includes a layout design of a printed circuit board assembly, which identifies physical design characteristics of the layout design of the printed circuit board assembly. The computing system can identify one or more manufacturing processes capable of manufacturing at least a portion of the printed circuit board assembly having the identified physical design characteristics. The computing system can include a map or correlation between the manufacturing processes and manufacturing-related design constraints. The computing system can select one or more manufacturing checks that define manufacturing-related design constraints correlated to the identified manufacturing processes.