Patents by Inventor Max D. Alexander

Max D. Alexander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive polymeric nanocomposite materials
    Patent number: 7029603
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: April 18, 2006
    Assignee: University of Dayton
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Conductive polymeric nanocomposite materials
    Publication number: 20040089851
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 13, 2004
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Method of forming conductive polymeric nanocomposite materials
    Patent number: 6680016
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: January 20, 2004
    Assignee: University of Dayton
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Method of forming conductive polymeric nanocomposite materials and materials produced thereby
    Publication number: 20030039816
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Application
    Filed: August 17, 2001
    Publication date: February 27, 2003
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Oxyallyl pendent benzazole polymeric materials
    Patent number: 6437081
    Abstract: Oxyallyl pendent polymer system having repeating units of the formulae hereinafter referred to as structure A, wherein x has a value of about 0.1 to 1.0 and y has a value of 1.0-x, and hereinafter referred to as structure B, wherein the sum of p+q has a value of about 0.1 to 1.0, r has a value of 1.0-(p+q) and the molar ratio of p:q is about 9:1 to 1:9, wherein Bz is a benzazole unit selected from the group consisting of wherein X is —O—, —S— or —NH—, and R is selected from the group consisting of and wherein Ar is an aromatic group.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: August 20, 2002
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Fred E. Arnold, Thuy D. Dang, Robert J. Spry, Max D. Alexander
  • High temperature polymers with low dielectric properties
    Patent number: 6057417
    Abstract: A polymer system having repeating units of the formula: ##STR1## wherein A is --H or --OH, x has a value of 0.5 to 1.0 and y has a value of 1.0-x, exhibits a high glass transition temperature (T.sub.g) and a low dielectric constant. The polymer system is useful in the area of microelectronic packaging.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: May 2, 2000
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Fred E. Arnold, Thuy D. Dang, Robert J. Spry, Max D. Alexander, Patrick T. Mather