Abstract: A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Abstract: A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Abstract: A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Abstract: A system and process for cleaning a hollow interior or a passageway of a metal member including an external container having counter electrode material with a higher potential than the metal member with the counter electrode material being dc coupled to the metal member, and electrolyte passing through the container to contact the counter electrode material and fluidicly coupled into the hollow interior or the passageway of the metal member to clean same.

Abstract: A system and process for chemical milling or stripping a surface portion and/or surface deposit from metal products, such as chemically milling a metal to remove surface defects and/or stripping non-metallic deposits from a metal surface. The metal product is associated with an electrolyte, such as by being immersed in a tank filled with the electrolyte, such as a diluted acid mixture. A counter electrode having a higher potential than the metal of the metal product is also associated with the electrolyte. The counter electrode is dc coupled to the metal product, or to a conductive component in direct contact with the metal product, such that electric current flows from the metal to the counter electrode due to the difference in the natural potentials of the metal and the counter electrode. The surface portion or deposit is thereby stripped or milled from the metal product.

Abstract: A system and process for cleaning a hollow interior or a passageway of a metal member including an external container having counter electrode material with a higher potential than the metal member with the counter electrode material being dc coupled to the metal member, and electrolyte passing through the container to contact the counter electrode material and fluidicly coupled into the hollow interior or the passageway of the metal member to clean same.

Abstract: A system and process for chemical milling or stripping a surface portion and/or surface deposit from metal products, such as chemically milling a metal to remove surface defects and/or stripping non-metallic deposits from a metal surface. The metal product is associated with an electrolyte, such as by being immersed in a tank filled with the electrolyte, such as a diluted acid mixture. A counter electrode having a higher potential than the metal of the metal product is also associated with the electrolyte. The counter electrode is dc coupled to the metal product, or to a conductive component in direct contact with the metal product, such that electric current flows from the metal to the counter electrode due to the difference in the natural potentials of the metal and the counter electrode. The surface portion or deposit is thereby stripped or milled from the metal product.