Patents by Inventor Max Eickenscheidt

Max Eickenscheidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transparent multi-layer assembly and production method
    Patent number: 11949029
    Abstract: A transparent multi-layer assembly includes a transparent carrier structure comprising a polymer material and an electrically conductive transparent layer comprising an electrically conductive oxide. A silicon carbide layer is arranged as an adhesion promoter between the transparent carrier structure and the electrically conductive transparent layer.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: April 2, 2024
    Assignee: Albert-Ludwigs-Universität Freiburg
    Inventors: Max Eickenscheidt, Annette Mittnacht, Thomas Stieglitz, Marie T. Alt
  • Implantable electrode arrangement and method of manufacture
    Patent number: 11819681
    Abstract: An implantable electrode arrangement includes an electrically insulating carrier structure and an electrically conductive layer including an electrically conductive thin film layer. The electrically conductive thin film layer is structured to form at least one implantable electrode. The at least one implantable electrode has a local fractalization through a self-similar structuring chosen such that a mechanical resonance of the electrode in response to electric excitation with an excitation voltage is minimized.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: November 21, 2023
    Assignee: Albert-Ludwigs-Universität Freiburg
    Inventors: Jennifer Schulte, Thomas Stieglitz, Max Eickenscheidt
  • Transparent Multi-Layer Assembly and Production Method
    Publication number: 20220005962
    Abstract: A transparent multi-layer assembly includes a transparent carrier structure comprising a polymer material and an electrically conductive transparent layer comprising an electrically conductive oxide. A silicon carbide layer is arranged as an adhesion promoter between the transparent carrier structure and the electrically conductive transparent layer.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Applicant: Albert-Ludwigs-Universitat Freiburg
    Inventors: Max Eickenscheidt, Annette Mittnacht, Thomas Stieglitz, Marie T. Alt
  • Implantable Electrode Arrangement And Method Of Manufacture
    Publication number: 20210106814
    Abstract: An implantable electrode arrangement includes an electrically insulating carrier structure and an electrically conductive layer including an electrically conductive thin film layer. The electrically conductive thin film layer is structured to form at least one implantable electrode. The at least one implantable electrode has a local fractalization through a self-similar structuring chosen such that a mechanical resonance of the electrode in response to electric excitation with an excitation voltage is minimized.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 15, 2021
    Applicant: Albert-Ludwigs-Universität Freiburg
    Inventors: Jennifer Schulte, Thomas Stieglitz, Max Eickenscheidt