Abstract: A micro-electromechanical systems (MEMS) device includes a substrate comprising at least one anchor, a proof mass having first and second deceleration extensions extending therefrom, a motor drive comb, a motor sense comb, a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb. The suspensions are anchored to the substrate. A body is attached to the substrate. At least one deceleration beam extends from a first side of said body. The at least one deceleration beam is configured to engage at least one of the first and second deceleration extensions and slow or stop the proof mass before the proof mass contacts the motor drive comb and the motor sense comb.

Abstract: An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.

Abstract: A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.

Abstract: An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.

Abstract: A Leadless Chip Carrier (LCC) device and method of attaching a Microelectromechanical (MEMS) device into an LCC package. An alignment plate is die bonded into the bottom of an LCC. The alignment plate includes fiducials fabricated into top and bottom metal layers, thus producing a tolerance that will be an order of magnitude better than the tolerance of fiducials included in the LCC. A bump pattern and MEMS die are attached based on the alignment plate and fiducials giving a much improved die to bump alignment.

Abstract: A micro-electromechanical systems (MEMS) device includes a substrate comprising at least one anchor, a proof mass having first and second deceleration extensions extending therefrom, a motor drive comb, a motor sense comb, a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb. The suspensions are anchored to the substrate. A body is attached to the substrate. At least one deceleration beam extends from a first side of said body. The at least one deceleration beam is configured to engage at least one of the first and second deceleration extensions and slow or stop the proof mass before the proof mass contacts the motor drive comb and the motor sense comb.

Abstract: A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.

Abstract: An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

Abstract: Structures and methods for frequency shifting rotational harmonics in MEMS devices are disclosed. An illustrative MEMS device can include a substrate, a sense electrode coupled to the substrate, and a proof mass adjacent to the sense electrode. A number of non-uniformly dispersed holes or openings on the proof mass can be configured to alter the distribution of mass within the proof mass. During operation, the presence of the holes or openings alters the frequency at which the proof mass rotates about a centerline in a rotational mode, reducing the introduction of harmonics into the drive and sense systems.

Abstract: Methods and systems for controlling the internal dampening of MEMS sensors is provided. In one illustrative embodiment, a MEMS sensor is provide that can be tunable to a desired Q value, and the Q value may be held relatively constant over the expected life of the sensor. The MEMS sensor package may include a chamber that houses a MEMS sensor. An inert gas may be provided in the chamber at a desired or specified pressure, wherein the inert gas may be backfilled into the chamber after the chamber is evacuated. The pressure of the inert gas may be set to achieve a desired Q value.

Abstract: A device package that includes a thin film getter that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber. The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique.

Abstract: An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

Abstract: A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.